Sony hcd hpx 10w service manual

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2 HCD-HPX10W TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 4 2. GENERAL ................................................................... 5 3. DISASSEMBLY 3-1. Disassembly Flow-1 ........................................................ 7 3-2. Disassembly Flow-2 ........................................................ 8 3-3. Optical Pick-Up Block .................................................... 9 3-4. Side Plate (L) (R), Top Panel Section .............................. 10 3-5. Mechanical Deck ............................................................. 11 3-6. Front Panel Section ......................................................... 12 3-7. PANEL (1), (2) Board, HEADPHONE Board ................ 12 3-8. Tuner (FM/AM), DC Fan ................................................ 13 3-9. MAIN Board .................................................................... 14 3-10. Rear Panel Section ........................................................... 14 3-11. AMP Board, Switching Regulator ................................... 15 3-12. POWER Board ................................................................ 15 3-13. CD Mechanism Deck (CDM82A) ................................... 16 3-14. Plate (Cover Top) ............................................................. 17 3-15. Top Section ...................................................................... 17 3-16. Arm Section ..................................................................... 18 3-17. CD Mechanism Deck Section ......................................... 19 3-18. Sub Gear (2 Step), Sub Slider Assy ................................. 20 3-19. Arm (R) ........................................................................\ ... 21 3-20. Gear (Stock Planet) (Right) ............................................. 22 3-21. Lever (Sub Gear Back L) ................................................ 22 3-22. Arm (L) ........................................................................\ .... 23 3-23. Gear (Stock Rot Long) (Left) .......................................... 24 3-24. Gear (Stock Rot Short) (Right) ....................................... 24 3-25. Stocker (1) Assy To Stocker (5) Assy .............................. 25 3-26. SPR-E (Roller Slider Upper) (Top Section) .................... 26 3-27. Rubber Roller (Top Section) ........................................... 26 3-28. LOD Motor ...................................................................... 27 3-29. Slider (Push-popup) ......................................................... 27 3-30. Rotary Encoder ................................................................ 28 3-31. Assembling of the Rotary Encoder ................................. 29 3-32. ELV Motor ....................................................................... 30 3-33. Chassis (Top), Chassis (Bottom) ..................................... 31 3-34. Lever (Loading R, Loading L) ........................................ 32 3-35. Disc Stop Lever ............................................................... 33 3-36. DRIVER Board ............................................................... 33 3-37. CD Board ........................................................................\ . 34 3-38. Optical Pick-up (KSM-215DCP) .................................... 34 3-39. Base Unit Section ............................................................ 35 3-40. Lever (BU Lock) ............................................................. 35 3-41. Gear (IDL-B) ................................................................... 36 3-42. Gear (IDL-C) ................................................................... 36 3-43. SPR-E (Tako-Back) ......................................................... 37 3-44. Plate (Push) Assy ............................................................. 38 3-45. SPR-P (Lock) .................................................................. 39 4. ASSEMBLY 4-1. Assembly Flow ................................................................ 40 4-2. Assembling of the Stocker Section ................................. 41 4-3. Assembling of the Gear (Stock Rot Short) (Right) ......... 42 4-4. Assembling of the Gear (Stock Rot Long) (Left) ............ 43 4-5. Confirming the Assembling of the Stocker Section ........ 44 4-6. Assembling of the Gear (Stock Rotary Left) ................... 45 4-7. Assembling of the Gear (Stock Rotary Right) ................ 46 4-8. Assembling of the Lever (Sub Gear Back L) .................. 47 4-9. Assembling of the Gear (Sub Gear Pin Right) ................ 48 4-10. Assembling of the Lever (Sub Gear Back R) .................. 49 4-11. Assembling of the Sub Gear (Idler) ................................ 50 4-12. Assembling of the Sub Gear (2 Step) .............................. 51 4-13. Confirming the Assembling of the Arm Section ............. 52 5. TEST MODE ............................................................... 53 6. ELECTRICAL ADJUSTMENTS .......................... 55 7. DIAGRAMS 7-1. Block Diagram -“ CD Servo Section -“ ............................. 59 7-2. Block Diagram -“ MAIN Section -“ .................................. 60 7-3. Block Diagram -“ PANEL/POWER SUPPLY Section -“ ........................... 61 7-4. Printed Wiring Board -“ CD Board -“ ............................... 62 7-5. Schematic Diagram -“ CD Board -“ .................................. 63 7-6. Printed Wiring Board -“ CD MECHANISM Section -“ .... 64 7-7. Schematic Diagram -“ CD MECHANISM Section -“ ...... 65 7-8. Printed Wiring Board -“ MAIN Board -“ .......................... 66 7-9. Schematic Diagram -“ MAIN Board (1/3) -“ .................... 67 7-10. Schematic Diagram -“ MAIN Board (2/3) -“ .................... 68 7-11. Schematic Diagram -“ MAIN Board (3/3) -“ .................... 69 7-12. Printed Wiring Board -“ AMP Board -“ ............................ 70 7-13. Schematic Diagram -“ AMP Board -“ ............................... 71 7-14. Printed Wiring Board -“ PANEL Section -“ ...................... 72 7-15. Schematic Diagram -“ PANEL Section -“ ......................... 73 7-16. Printed Wiring Board -“ POWER Board -“ ....................... 74 7-17. Schematic Diagram -“ POWER Board -“ .......................... 75 8. EXPLODED VIEWS 8-1. Side Plate, Top Panel Section .......................................... 83 8-2. Front Panel Section ......................................................... 84 8-3. Chassis Section ................................................................ 85 8-4. CD Mechanism Deck Section-1 (CDM82A) .................. 86 8-5. CD Mechanism Deck Section-2 (CDM82A) .................. 87 8-6. CD Mechanism Deck Section-3 (CDM82A) .................. 88 8-7. CD Mechanism Deck Section-4 (CDM82A) .................. 89 8-8. CD Mechanism Deck Section-5 (CDM82A) .................. 90 8-9. CD Mechanism Deck Section-6 (CDM82A) .................. 91 8-10. CD Mechanism Deck Section-7 (CDM82A) .................. 92 8-11. CD Mechanism Deck Section-8 (CDM82A) .................. 93 8-12. CD Mechanism Deck Section-9 (CDM82A) .................. 94 8-13. CD Mechanism Deck Section-10 (CDM82A) ................ 95 8-14. Base Unit Section (BU-F1BD81A) ................................. 96 9. ELECTRICAL PARTS LIST .................................. 97

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3 HCD-HPX10W SAFETY CHECK-OUT After correcting the original service problem, perform the following safety check before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE TEST The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods.1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suitable. (See Fig. A) Fig. A. Using an AC voltmeter to check AC leakage. 1.5 k -„¦ 0.15 µF AC voltmete r (0.75 V) To Exposed Metal Parts on Set Earth Ground Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. This appliance is classified as a CLASS 1 LASER product. This label is located on the rear exterior. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS Q UE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.