Sony xm 5150 gsx service manual

Page 1

XNI-515IIGSX

SERVICE MANUAL

Ver 1.0 2001.12

US Model
Canadian Model

SPECIFICATIONS

AUDIO POWER SPECIFICATIONS

POWER OUTPUT AND TOTAL HARMONIC DISTORTION

40 watts/150 watts per channel minimum continuous average power into
4 ohms, Schanneis driven from 50 Hz to 20 kHz/20 Hz to 300 Hz
(subwoofer) with no more than 0.04% total harmonic distortion per Car
Audio Ad Hoc Committee Standards.

Other Specifications
circuit system OTL (output transfot-merless) Circuit
Pulse power supply
Inputs RCA pinjacks
Outputs Speaker terminals
Speaker impedance 2 7 8 9 (stereo)
4 7 8 9 (when used as a bridging amplifier)
MEIXImIIm outputs 30 watts X 4 + 300 watts x 1 (at 4 9)
Rated outputs (supply voltage at 14.4 V)
5 Speakers: 40 watts x 4 (50 Hz 7 20 kHz. 0.04%

lnpttt level adjustment range

0.2 7 oov (RCA pin jacks)

507 300 Hz, 712 dB/oct

so 7 300 Hz, 712 dB/oct

12 v DC car battery

(negalwe ground)

Power supply voltage 10.5 7 [6 V

Current drain at rated output :
Remote input :

Higlrpnss tilter
Lowpa - tilter
Power requirements

42 A
.0 mA

3 Speakers:

Frequency response
Harmonic distortion

9-873-437-01
2001 L0400-1
© 2001. 12

THD, at 4 :2) + 150 watts X 1 (20 7 Dimensiom Approx. 358 X 30 X 264 mm

300 Hz, 004% THD.a14 Q) (w/h/d) (14 in x 2 X 10 1/2 in.) not incl.

50 watts X 4 (50 Hz 7 20 kHz. 0.1% projecting parts and controls

THD, at 2 :2) + 180 watts X 1 (20 7 Mass Approx. 3.5 kg (7 lb. 11 oz.) nol incl, accessories

300 Hz, 0.1% THD. at 2 9)
120 watts >< 2(501-12 7 20 kHz. 0.1%
THD,a14 n) + 150 watts X 1 (20 7
300 Hz, 004% THD, at 4 n)

5 H1750 kHz (til dB)

0.005% or less (at 1 kHz. 4 9)

Sony Corporation
e Vehicle Company

Published by Sony Engineering Corporation

Supplied accessories

Mounting screws (4)

Design and ,YleL'i/IullilfliS (1m tub/ml m 1])!ng wit/mm

mmm,

STEREO POWER AMPLIFIER
S ONY;

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XM-515OGSX

TABLE OF CONTENTS
1. GENERAL
Location and Function of Controls .......................................... 3
Connections ............................................................................. 4

2. DISASSEMBLY
2-1. Plate, Bottom .....
22. Amp Board Section
23. Amp Board, HPF Board, LPF Board
274. LED Board .......................................

\iqco

3. ELECTRICAL ADJUSTMENT ...................................... 8

4. DIAGRAMS
4- 1. Block Diagram .................................................................... 9
4.2 Printed Wiring Boards iHPF, LPF, LED Sectioni
4-3. Schematic Diagram iHPF, LPF, LED Section
4-4. Schematic Diagram iAmp Section (1/2)7 ......
4.5 Schematic Diagram iAmp Section (2/2}
4A6. Printed Wiring Board iAmp Sectioni .....

.12

5. EXPLODED VIEWS

5-1. Heat Sink (Main) Section .................................................. 16
5-2. Amp Board Section ........................................................... 17
6. ELECTRICAL PARTS LIST ........................................ 18

Notes on Chip Component Replacement

I Never reuse a disconnected chip component.

I Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

SAFETY-RELATED COMPONENT WARNING !!

COMPONENTS IDENTIFIED BY MARK A OR DOTTED LINE
WITH MARK A ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL T0 SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.

2

ATTENTION AU COMPOSANT AYANT RAPPORT
A LA SECURITE!!

LES COMPOSANTS IDENTIFIES PAR UNE MARQUE A SUR LES
DIAGRAMMES SCHEMATIQUES ET LA LISTE DES PIECES
SONT CRITIQUES POUR LA SECURITE DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIECES
SONY DONT LES NUMEROS SONT DONNES DANS CE MANUEL
OU DANS LES SUPPLEMENTS PUBLIES PAR SONY.