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Extracted text from sony tcm 50 dv service manual (Ocr-read)
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TABLE OF CONTENTS
Flexible Circuit Board Repairing
·Keep the temperature of the soldering iron around 270ûC during
repairing.
·Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
·Be careful not to apply force on the conductor when soldering
or unsoldering. Notes on Chip Component Replacement
·Never reuse a disconnected chip component.
·Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
1. SERVICING NOTE..................................................... 3
2. GENERAL
Operating the Unit ................................................................... 4
3. DISASSEMBLY
3-1. Cabinet, Cassette Lid Assy ................................................. 6
3-2. MAIN Board, Cassette Machanism .................................... 7
3-3. Belt ...................................................................................... 8
3-4. Head .................................................................................... 8
3-5. Motor, DC ........................................................................... 9
3-6. Note for Installation of Main Board .................................... 9
4. MECHANICAL ADJUSTMENTS............................ 10
5. ELECTRICAL ADJUSTMENTS............................. 10
6. DIAGRAMS
6-1. Block Diagram .................................................................. 11
6-2. Printed Wiring Board ÐMain SectionÐ .............................. 13
6-3. Schematic Diagram ÐMain SectionÐ ................................. 15
6-4. Printed Wiring Board ÐPanel SectionÐ ............................. 17
6-5. Schematic Diagram ÐPanel SectionÐ ................................ 18
6-6. IC Pin Description ............................................................. 20
7. EXPLODED VIEWS
7-1. Case Section ...................................................................... 21
7-2. Panel Section ..................................................................... 22
7-3. Mechanism Deck Section-1 .............................................. 23
7-4. Mechanism Deck Section-2 .............................................. 24
8. ELECTRICAL PARTS LIST.................................... 25
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TP30TP30
TP20TP20
S101
PB REC S103
(POWER)
SECTION 1
SERVICING NOTE
1-1. SERVICE MODE
Mode to allow the mechanical parts to operate with the main board
open.
This set uses the photo reflector PH701 to detect the rotation of the
idler gear. PH701 is on the main board and so removal of the main
board does not allow the set to detect the rotation of the idler gear.
This makes motor control impossible which prevents normal
operation.
When repairing the set as energized with the main board removed,
proceed as follows:
1. Setting
1) Remove the cabinet (rear) (refer to the Disassembly) and open
the main board.
2) Apply a trapezoidal of 10 to 100 Hz (at 1.3 V) from oscillator to
TP20. (Connect the ground to TP30.)
3) Supply DC 3.0 V to the positive and negative terminals of the
battery with a stabilized power supply.
2. FF mode
1) Apply a trapezoidal to hall sensor TP20.
2) Press the FF key.
3) Turn on the S103 (POWER) switch.
3. REW mode
1) Apply a trapezoidal to hall sensor TP20.
2) Press the REW key.
3) Turn on the S103 (POWER) switch.
4. PLAY mode
1) Apply a trapezoidal to hall sensor TP20.
2) Press the PLAY key.
3) Change over the S101 (REC/PB) switch to PB side.
4) Turn on the S103 (POWER) switch.
5. REC mode
1) Apply a trapezoidal to hall sensor TP20.
2) Press the REC key.
3) Change over the S101 (REC/PB) switch to REC side.
4) Turn on the S103 (POWER) switch.
Ð main board (conductor side) Ð
Ð main board (component side) Ð
