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Extracted text from sony tc s 9 service manual (Ocr-read)
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TC-S9
TABLE OF CONTENTS
1. SERVICING NOTES
................................................ 3
2. GENERAL
Location of Controls ....................................................... 4
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 5
3-2. Case ................................................................................. 5
3-3. MAIN Board ................................................................... 6
3-4. Front Panel Section ......................................................... 6
3-5. Tape Mechanism Deck
(TCM-230AWR41, TCM-230MWR41) ......................... 7
3-6. LEAF SW Board, HEAD (A) Board and
HEAD (B) Board ............................................................ 7
4. TEST MODE .............................................................. 8
5. MECHANICAL ADJUSTMENTS ....................... 9
6. ELECTRICAL ADJUSTMENTS ......................... 9
7. DIAGRAMS
7-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 13
7-2. Schematic Diagram -“ MAIN Section (1/2) -“................ 14
7-3. Schematic Diagram -“ MAIN Section (2/2) -“................ 15
7-4. Printed Wirings Boards -“ MAIN Section -“................... 16
7-5. Schematic Diagram -“ LEAF SW Section -“................. 17
7-6. Printed Wiring Board -“ LEAF SW Section -“............... 17
7-7. Schematic Diagram -“ PANEL Section -“....................... 18
7-8. Printed Wiring Boards -“ PANEL Section -“.................. 18
7-9. IC Pin Function Description ........................................... 19
8. EXPLODED VIEWS
8-1. General Section ............................................................... 21
8-2. Front Panel Section ......................................................... 22
8-3. Tape Mechanism Deck Section
(TCM-230AWR41) .......................................................... 23
8-4. Tape Mechanism Deck Section
(TCM-230MWR41) ........................................................ 24
8-5. Sub Chassis Assy Section
(TCM-230MWR41) ........................................................ 25
9. ELECTRICAL PARTS LIST ............................... 26Notes on chip component replacement
-Never reuse a disconnected chip component.
-Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
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TC-S9
SECTION 1
SERVICING NOTES
Model PART No.
AEP and UK models 4-236-839-0 []
Australian, Saudi Arabia
and Korean models4-236-839-1 []
E and Singapore models 4-236-839-2 []
Mexican model 4-236-839-3 []
Thai model 4-236-839-4 []
- MODEL IDENTIFICATION
-“ Rear Panel -“ This set is a component of the MHC-S9D.
The MHC-S9D system configuration is as shown below, and there-
fore it does not operate normally unless all four components are
connected.
In performing the repair, connect all components with the system
cables.
Note: The precaution to the users is described on the label stuck
on the back panel (DVD/video CD/CD player) and in the trouble-
shooting section in the Operation Manual.
System Configuration:
POWER SUPPLYAC IN
TA
MASTER & GRAPHIC µcon
ST
TC µcon
TC
DISPLAY
HTC & MB µcon
DV P
POWER BLOCK
PART No.
- TAPE MECHANISM DECK DISCRIMINATION
TCM-230AWR41 and TCM-230MWR41 are used for the tape
mechanism deck of this set, and they can be discriminated as shown
below.
main chassisstraight L-shape
TCM-230AWR41 TCM-230MWR41 main chassis