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STR-LV700R
2
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40 Β°C higher than
ordinary solder. Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to
about 350 Β°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
T ABLE OF CONTENTS
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE
PA RTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART NUM-
BERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLE-
MENTS PUBLISHED BY SONY.
Specifications ........................................................................\
.... 1
1.GENERAL ...................................................................... 3
2. SERVICING NOTES ................................................... 4
3. TEST MODE ................................................................. 7
4. DIAGRAMS
4-1. IC Pin Function Descriptions ................................ 13
4-2. Block Diagrams - T uner/DSP Section -............... 18
Block Diagrams - Display/Power Section -......... 19
4-3. Printed Wiring Boards
- Digital Section (Side A)-................................... 20
Printed Wiring Boards
- Digital Section (Side B)-................................... 21
4-4. Schematic Diagram - Digital Section (1/3)-........ 22
4-5. Schematic Diagram - Digital Section (2/3)-........ 23
4-6. Schematic Diagram - Digital Section (3/3)-........ 24
4-7. Schematic Diagram - Amp Section (1/2)-........... 25
4-8. Schematic Diagram - Amp Section (2/2)-........... 26
4-9. Printed Wiring Boards - Amp Section-................ 27
4-10. Schematic Diagram - Display Section-............... 28
4-11. Printed Wiring Boards - Display Section-........... 29
4-12. Schematic Diagram - Power Section-.................. 30
4-13. Printed Wiring Boards- Power Section-.............. 31
4-14. IC Block Diagrams................................................ 32
5. EXPLODED VIEWS
5-1. Front Panel Section................................................. 33
5-2. Cabinet Section ........................................................ 34
6. ELECTRICAL PARTS LIST .................................... 35
Video section
Input
VIDEO: 1 Vp-p 75 -¦
Output
MONITOR: 1 Vp-p 75 -¦
Network Media section
Hardware decoder MPEG2
Maximum 8 Mbps, 720 x 480 pixels, 30 fps
MPEG1
1.41 Mbps, 352 x 240 pixels, 30 fps
Playable file formats Giga Pocket video
MPEG2, MPEG1
SonicStage music
ATRAC3, ATRAC3plus,WAV, MP3. WMA is
not supported.
Photo Server images
BMP, TIFF, GIF, JPEG,PNG
Interface Network
100Base-TX
Compatible computers VAIO computers bought after October 2003,
running Windows XP
Professional or Windows
XP Home Edition
General
Power requirements 230 V AC, 50/60 Hz
Power consumption 95 W
Dimensions 430 x 65 x 288 mm including projections and controls
Mass (approx.) 3.2 kg
Pa ckag e contents
AM loop antenna (1)
Allen screwdriver (1)
Connection adapter (1)
Cross-wired cable (1)
FM wire antenna (1)
Network cable (approx. 170 cm, 1)
Network cable ferrite core (1)
R6 (AA) batteries (2)
Remote control (RM-U70R)(1)
Speaker cable ferrite core (2)
Speaker plug (5)
Design and specifications are subject to change without notice.
- Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Notes on chip component replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
V er 1.1
