Page 1
ST-SDB900
2
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
-Unleaded solder melts at a temperature about 40Β°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350Β°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
TABLE OF CONTENTS
1. GENERAL
................................................................... 3
2. TEST MODE ............................................................... 4
3. DIAGRAMS
3-1. Block Diagram ................................................................ 9
3-2. Printed Wiring Board - MAIN Board (Side A) - ............ 10
3-3. Printed Wiring Board - MAIN Board (Side B) - ............ 11
3-4. Schematic Diagram - MAIN Board (1/3) - .................... 12
3-5. Schematic Diagram - MAIN Board (2/3) - .................... 13
3-6. Schematic Diagram - MAIN Board (3/3) - .................... 14
3-7. Printed Wiring Board
- TRANS, AC SW, JOG, RM Board - ............................ 15
3-8. Printed Wiring Board - DISPLAY Board - .................... 16
3-9. Schematic Diagram - DISPLAY Board - ....................... 17
4. EXPLODED VIEWS
4-1. Case, Front Panel Section ................................................ 20
4-2. Chassis Section ................................................................ 21
5. ELECTRICAL PARTS LIST .................................. 22
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE
PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART NUM-
BERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLE-
MENTS PUBLISHED BY SONY.
-Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
-Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Notes on chip component replacement
-Never reuse a disconnected chip component.
-Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
DAB frequency table
Band-III (174 to 240 MHz)
Frequency Label Frequency Label
174.928MHz 5A 209.936MHz 10A
176.640MHz 5B 211.648MHz 10B
178.352MHz 5C 213.360MHz 10C
180.064MHz 5D 215.072MHz 10D
181.936MHz 6A 216.928MHz 11A
183.648MHz 6B 218.640MHz 11B
185.360MHz 6C 220.352MHz 11C
187.072MHz 6D 222.064MHz 11D
188.928MHz 7A 223.936MHz 12A
190.640MHz 7B 225.648MHz 12B
192.352MHz 7C 227.360MHz 12C
194.064MHz 7D 229.072MHz 12D
195.936MHz 8A 230.784MHz 13A
197.648MHz 8B 232.496MHz 13B
199.360MHz 8C 234.208MHz 13C
201.072MHz 8D 235.776MHz 13D
202.928MHz 9A 237.488MHz 13E
204.640MHz 9B 239.200MHz 13F
206.352MHz 9C
208.064MHz 9D
* This tuner does not support L-Band reception.
