Sony SCD XA9000ES Service Manual

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2 SCD-XA9000ES CAUTION The use of optical instruments with this product will increase eye hazard. For the customers in Canada This Class B digital apparatus complies with Canadian ICES-003. ATTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU D ANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. Notes on chip component replacement -N ever reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -K eep the temperature of the soldering iron around 270 ËšC dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. SAFETY CHECK-OUT After correcting the original service problem, perform the follow- ing safety check before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE TEST T he AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a pas- sive VOM that is suitable. Nearly all battery operated digital m ultimeters that have a 2 V AC range are suitable. (See Fig. A) Fig. A. Using an AC voltmeter to check AC leakage. 1.5 k -„¦ 0.15 µF AC voltmete r (0.75 V) To Exposed Metal Parts on Set Earth Ground AEP model UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

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3 SCD-XA9000ES TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 4 2. GENERAL ................................................................... 10 3. DISASSEMBLY 3-1. Disassembly Flow........................................................... 13 3-2. Case (Top), Side Plate ..................................................... 14 3-3. Loading Panel Assy......................................................... 14 3-4. Front P anel Section......................................................... 15 3-5. MAIN Board, Br acket (MAIN) ...................................... 15 3-6. RF Board, Mechanism Deck (CDM19JB-DVBU4C or CDM19JB-D VBU4D)........... 16 3-7. Disc Table, Belt, Loading Motor (M1) ........................... 16 3-8. Optical Pick-up (KHM-230AAA) .................................. 17 3-9. Base Unit (DVBU4C or DVBU4D)................................ 18 4. TEST MODE .............................................................. 19 5. DIAGRAMS 5-1. Block Diagram -“ RF/SERVO Section -“........................ 26 5-2. Block Diagram -“ MAIN Section (1/2) -“ ....................... 27 5-3. Block Diagram -“ MAIN Section (2/2) -“ ....................... 28 5-4. Block Diagram -“ A UDIO Section (1/2) -“..................... 29 5-5. Block Diagram -“ A UDIO Section (2/2) -“..................... 30 5-6. Block Diagram -“ LINK Section -“ ................................. 31 5-7. Block Diagram -“ PANEL/POWER SUPPLY Section -“ .......................... 32 5-8. Note for Printed Wiring Boards and Schematic Diagrams ....................................................... 33 5-9. Printed Wiring Boards -“ SERVO Section -“.................. 34 5-10. Schematic Diagram -“ SERVO Section -“....................... 35 5-11. Printed Wiring Board -“ MAIN Board (Component Side) -“ .............................. 36 5-12. Printed Wiring Board -“ MAIN Board (Conductor Side) -“ ................................ 37 5-13. Schematic Diagram -“ MAIN Board (1/7) -“.................. 38 5-14. Schematic Diagram -“ MAIN Board (2/7) -“.................. 39 5-15. Schematic Diagram -“ MAIN Board (3/7) -“.................. 40 5-16. Schematic Diagram -“ MAIN Board (4/7) -“.................. 41 5-17. Schematic Diagram -“ MAIN Board (5/7) -“.................. 42 5-18. Schematic Diagram -“ MAIN Board (6/7) -“.................. 43 5-19. Schematic Diagram -“ MAIN Board (7/7) -“.................. 44 5-20. Printed Wiring Board -“ D-OUT Board -“...................... 45 5-21. Schematic Diagram -“ D-OUT Board -“ ......................... 45 5-22. Printed Wiring Board -“ MOTHER Board (Component Side) -“ ........................ 46 5-23. Printed Wiring Board -“ MOTHER Board (Conductor Side) -“ ......................... 47 5-24. Schematic Diagram -“ MOTHER Board (1/2) -“............ 48 5-25. Schematic Diagram -“ MOTHER Board (2/2) -“............ 49 5-26. Printed Wiring Board -“ AUDIO FRONT Boar d -“ ......... 50 5-27. Schematic Diagram -“ A UDIO FRONT Board -“ ........... 51 5-28. Printed Wiring Board -“ AUDIO SURR Board -“ ........... 52 5-29. Schematic Diagram -“ A UDIO SURR Board -“.............. 53 5-30. Printed Wiring Board -“ A UDIO C/SW Board -“............ 54 5-31. Schematic Diagram -“ A UDIO C/SW Board -“.............. 55 5-32. Schematic Diagram -“ LINK Board (1/2) -“ ................... 56 5-33. Schematic Diagram -“ LINK Board (2/2) -“ ................... 57 5-34. Printed Wiring Board -“ LINK Board -“......................... 58 5-35. Printed Wiring Boards -“ PANEL Section -“.................. 59 5-36. Schematic Diagram -“ PANEL Section (1/2) -“.............. 605-37. Schematic Diagram -“ PANEL Section (2/2) -“.............. 61 5-38. Printed Wiring Board -“ A-POWER Board (Component Side) -“ ....................... 62 5-39. Printed Wiring Boards -“ A-POWER (Conductor Side)/IC Boards -“ .................. 63 5-40. Schematic Diagram -“ A-POWER/IC Boards -“............. 64 5-41. Printed Wiring Board -“ D-POWER Board -“ ................. 66 5-42. Schematic Diagram -“ D-POWER Board -“................... 67 5-43. Printed Wiring Boards -“ AC/AC SW Boards -“ ............. 68 5-44. Schematic Diagram -“ A C/AC SW Boards -“................. 69 5-45. IC Pin Function Description ........................................... 74 6. EXPLODED VIEWS 6-1. Case Section.................................................................... 94 6-2. Front P anel Section-1 ...................................................... 95 6-3. Front P anel Section-2 ...................................................... 96 6-4. Bottom Section ................................................................ 97 6-5. Board Section-1 ............................................................... 98 6-6. Board Section-2 ............................................................... 99 6-7. Chassis Section .............................................................. 100 6-8. Mechanism Deck Section ..............................................101 6-9. Base Unit Section........................................................... 102 7. ELECTRICAL PARTS LIST .............................. 103 Ver. 1.3