Sony scd xb 780 service manual

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2 SCD-XB780 This appliance is classified as a CLASS 1 LASER product. This label is located on the rear exterior. The following caution label is located inside the unit. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 ËšC dur- ing repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 3 2. GENERAL ................................................................... 6 3. DISASSEMBLY 3-1. Disassembly Flow........................................................... 8 3-2. Case................................................................................. 9 3-3. Front Panel Section......................................................... 9 3-4. AUDIO Board, MAIN Board.......................................... 10 3-5. Mechanism Deck (CDM66B-DVBU6B)....................... 10 3-6. Base Unit (DVBU-6B).................................................... 11 4. TEST MODE .............................................................. 12 5. DIAGRAMS 5-1. Block Diagram -“ RF/SERVO Section -“........................ 20 5-2. Block Diagram -“ SERVO Section -“.............................. 21 5-3. Block Diagram -“ MAIN Section -“................................ 22 5-4. Block Diagram -“ AUDIO Section -“.............................. 23 5-5. Block Diagram -“ DISPLAY/KEY CONTROL/ POWER SUPPLY Section -“........................................... 24 5-6. Notes for Printed Wiring Boards and Schematic Diagrams....................................................... 25 5-7. Schematic Diagram -“ RF Board -“................................. 26 5-8. Printed Wiring Boards -“ RF/LOADING Boards -“.............................................. 27 5-9. Printed Wiring Board -“ MAIN Board (Component Side) -“.............................. 28 5-10. Printed Wiring Board -“ MAIN Board (Conductor Side) -“................................ 29 5-11. Schematic Diagram -“ MAIN (1/5)/ LOADING Boards -“............................. 30 5-12. Schematic Diagram -“ MAIN Board (2/5) -“.................. 31 5-13. Schematic Diagram -“ MAIN Board (3/5) -“.................. 32 5-14. Schematic Diagram -“ MAIN Board (4/5) -“.................. 33 5-15. Schematic Diagram -“ MAIN Board (5/5) -“.................. 34 5-16. Schematic Diagram -“ AUDIO/HP Boards -“................. 35 5-17. Printed Wiring Board -“ AUDIO Board (Component Side) -“............................ 36 5-18. Printed Wiring Boards -“ AUDIO (Conductor Side)/HP Boards -“..................... 37 5-19. Printed Wiring Boards -“ DISPLAY/KEY Boards -“ ...... 38 5-20. Schematic Diagram -“ DISPLAY/KEY Boards -“.......... 39 5-21. Printed Wiring Boards -“ POWER/POWER SW/PT Boards -“............................ 40 5-22. Schematic Diagram -“ POWER/POWER SW/PT Boards -“............................ 41 5-23. IC Pin Function Description........................................... 49 6. EXPLODED VIEWS 6-1. Case Section.................................................................... 61 6-2. Front Panel Section......................................................... 62 6-3. Chassis Section............................................................... 63 6-4. Mechanism Deck Section (CDM66B-DVBU6B).......... 64 6-5. Base Unit Section (DVBU-6B)....................................... 65 7.ELECTRICAL PARTS LIST ............................... 66CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.