Sony scd xa 3000 es service manual

Page 1

2 SCD-XA3000ES SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. Notes on chip component replacement -N ever reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -K eep the temperature of the soldering iron around 270 ËšC dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. This appliance is classified as a CLASS 1 LASER product. This label is located on the rear exterior. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 ËšC higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ËšC. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges oc- cur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

Page 2

3 SCD-XA3000ES TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 4 2. GENERAL ................................................................... 9 3. DISASSEMBLY 3-1. Disassembly Flow........................................................... 11 3-2. Case ........................................................................\ ......... 11 3-3. Loading Panel Assy......................................................... 12 3-4. Mechanism Deck (CDM66B-DVBU6B)....................... 12 3-5. AUDIO Boar d................................................................. 13 3-6. MAIN Board ................................................................... 13 3-7. POWER Boar d................................................................ 14 3-8. Front P anel Assy............................................................. 14 3-9. Base Unit (D VBU-6B).................................................... 15 4. TEST MODE .............................................................. 16 5. DIAGRAMS 5-1. Block Diagram -“ RF/SERVO Section -“........................ 24 5-2. Block Diagram -“ SERVO Section -“.............................. 25 5-3. Block Diagram -“ MAIN Section -“................................ 26 5-4. Block Diagram -“ AUDIO Section -“.............................. 27 5-5. Block Diagram -“ DISPLAY/KEY CONTROL/ POWER SUPPLY Section -“........................................... 28 5-6. Notes for Printed Wiring Boards and Schematic Diagrams ....................................................... 29 5-7. Printed Wiring Boards -“ RF Section -“.......................... 30 5-8. Schematic Diagram -“ RF Section -“............................... 31 5-9. Printed Wiring Board -“ MAIN Section (Component Side) -“............................ 32 5-10. Printed Wiring Board -“ MAIN Section (Conductor Side) -“.............................. 33 5-11. Schematic Diagram -“ MAIN Section (1/5) -“................ 34 5-12. Schematic Diagram -“ MAIN Section (2/5) -“................ 35 5-13. Schematic Diagram -“ MAIN Section (3/5) -“................ 36 5-14. Schematic Diagram -“ MAIN Section (4/5) -“................ 37 5-15. Schematic Diagram -“ MAIN Section (5/5) -“................ 38 5-16. Schematic Diagram -“ AUDIO Section -“....................... 39 5-17. Printed Wiring Board -“ AUDIO Section (Component Side) -“.......................... 40 5-18. Printed Wiring Board -“ AUDIO Section (Conductor Side) -“............................ 41 5-19. Printed Wiring Boards -“ PANEL Section -“.................. 42 5-20. Schematic Diagram -“ PANEL Section -“....................... 43 5-21. Printed Wiring Board -“ POWER Section (Component Side) -“......................... 44 5-22. Printed Wiring Board -“ POWER Section (Conductor Side) -“........................... 45 5-23. Printed Wiring Boards -“ AC Section (Component Side) -“.................................. 46 5-24. Printed Wiring Boards -“ AC Section (Conductor Side) -“................................... 47 5-25. Schematic Diagram -“ POWER Section -“..................... 48 5-26. Printed Wiring Board -“ HP Section -“........................... 49 5-27. Schematic Diagram -“ HP Section -“.............................. 49 5-28. IC Pin Function Description........................................... 57 6. EXPLODED VIEWS 6-1. Overall Section................................................................ 69 6-2. Front P anel Section-1 ...................................................... 70 6-3. Front P anel Section-2 ...................................................... 71 6-4. Chassis Section-1 ............................................................ 72 6-5. Chassis Section-2 ............................................................ 73 6-6. Mechanism Deck Section (CDM66B-DVBU6B).......... 74 6-7. Base Unit Section (D VBU-6B)....................................... 75 7. ELECTRICAL PARTS LIST ............................... 76