Sony rdr gx 257 service manual

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-“ 2 -“ RDR-GX257/GX380 SAFETY CHECK-OUT LEAKAGE TEST The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers' instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication is 0.75V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A) 1. Check the area of your repair for unsoldered or poorly-soldered connections. Check the entire board surface for solder splashes and bridges. 2. Check the interboard wiring to ensure that no wires are pinched or contact high-wattage resistors. 3. Look for unauthorized replacement parts, particularly transistors, that were installed during a previous repair. Point them out to the customer and recommend their replacement. 4. Look for parts which, though functioning, show obvious signs of deterioration. Point them out to the customer and recommend their replacement. 5. Check the line cord for cracks and abrasion. Recommend the replacement of any such line cord to the customer. 6. Check the B+ voltage to see it is at the values specified. 7. Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. After correcting the original service problem, perform the following safety checks before releasing the set to the customer: 1.5 k 0.15 µF AC voltmeter (0.75 V) To Exposed Metal Parts on Set Earth Ground Fig. A. Using an AC voltmeter to check AC leakage. WARNING!! WHEN SERVICING, DO NOT APPROACH THE LASER EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS NECESSARY TO CONFIRM LASER BEAM EMISSION, BE SURE TO OBSERVE FROM A DISTANCE OF MORE THAN 25 cm FROM THE SURFACE OF THE OBJEC - TIVE LENS ON THE OPTICAL PICK-UP BLOCK. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. RE - PLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉ - MENTS PUBLIÉS PAR SONY. Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. CAUTION: The use of optical instrument with this product will increase eye hazard. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radia - tion exposure. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear of the unit. (AEP, UK, Russian) This label is located on the laser protective housing inside the enclosure. CAUTION CLASS 3B VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN. AVOID EXPOSURE TO THE BEAM. UNDGÃ… UDSAETTELSE FOR STRÃ…LING. KLASSE 3B SYNLIG OG USYNLIG LASERSTRÃ…LING VED Ã…BNING. UNNGÃ… EKSPONERING FOR STRÃ…LEN.KLASSE 3B SYNLIGOG USYNLIG LASERSTRÃ…LING NÃ…R DEKSEL Ã…PENS. KLASS 3B SYNLIG OCH OSYNLIG LASERSTRÃ…LNING NÄR DENNA DEL ÄR ÖPPNAD. STRÃ…LEN ÄR FARLIG.AVATTAESSA OLET ALTTIINA LUOKAN 3B N ÄKYVÄÄJA NÄKYMÄTÖNTÄ LASERSÄTEILYLLE VARO ALTISTUMISTA S ÄTEELLE. ADVARSEL ADVARSEL VARNING VARO SICHTBARE UND UNSICHTBARE LASERSTRAHLUNG KLASSE 3B, WENN ABDECKUNG GE ÖFFNET. NICHT DEM STRAHL AUSSETZEN. VORSICHT

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-“ 3 -“ RDR-GX257/GX380 TABLE OF CONTENTS Section Title Page Section Title Page 1. SERVICE NOTE 1-1. EEPROM IC Setting ..................................................... 1-1 1-2. Disc Removal Procedure If The Tray Cannot Be Ejected (Forced Ejection) ............................................. 1-2 1-3. How To Distinguish Difference Of AEP Model .............. 1-2 2. DISASSEMBLY 2-1. Disassembly Flow ........................................................ 2-1 2-2. Top Case ...................................................................... 2-1 2-3. Front Panel ................................................................... 2-2 2-4. Mechanism Deck .......................................................... 2-2 2-5. IO Board ....................................................................... 2-3 2-6. Circuit Boards Location ................................................ 2-3 3. BLOCK DIAGRAMS 3-1. Overall Block Diagram (US, Canadian, E, Australian, Singapore) .................... 3-1 3-2. Overall Block Diagram (AEP, UK, Russian) ................. 3-2 3-3. Power Block Diagram ................................................... 3-3 4. SCHEMATIC DIAGRAMS 4-1. Frame Schematic Diagram (1/2) .................................. 4-1 4-2. Frame Schematic Diagram (2/2) .................................. 4-2 4-3. IO Board (SMPS) Schematic Diagram (1/4) ................. 4-3 4-4. IO Board (MICOM/TUNER) Schematic Diagram (2/4) .............................................. 4-4 4-5. IO Board (CONNECTOR/AV SWITCH/JACK) Schematic Diagram (3/4) .............................................. 4-5 4-6. IO Board (V DECODER/A.DAC/MIC INPUT) Schematic Diagram (4/4) .............................................. 4-6 4-7. MAIN Board (MPEG) Schematic Diagram (1/5) ........... 4-7 4-8. MAIN Board (DDR/LATCH/FLASH/RESET) Schematic Diagram (2/5) .............................................. 4-8 4-9. MAIN Board (DV1394/INTERFACE CONNECTOR) Schematic Diagram (3/5) .............................................. 4-9 4-10. MAIN Board (RF/MOTOR DRIVE) Schematic Diagram (4/5) .............................................. 4-10 4-11. MAIN Board (DSP) Schematic Diagram (5/5) .............. 4-11 4-12. HDMI Board (HDMI CONNECTOR) Schematic Diagram ...................................................... 4-12 4-13. TIMER Board (FL DRIVER) Schematic Diagram (1/2) .............................................. 4-13 4-14. TIMER Board (AV INPUT/USB INPUT/DV1394 INPUT) Schematic Diagram (2/2) .............................................. 4-14 4-15. KEY Board (POWER SWITCH) Schematic Diagram ... 4-15 4-16. Waveforms ................................................................... 4-16 4-17. Circuit Voltage Chart .................................................... 4-24 5. PRINTED WIRING BOARDS 5-1. IO Board (IO/SMPS) Printed Wiring Board (Component Side) ........................................................ 5-1 5-2. IO Board (IO/SMPS) Printed Wiring Board (Conductor Side) .......................................................... 5-2 5-3. MAIN Board (MAIN/LOADER) Printed Wiring Board (Component Side) ........................................................ 5-3 5-4. MAIN Board (MAIN/LOADER) Printed Wiring Board (Conductor Side) .......................................................... 5-4 5-5. HDMI Board (HDMI CONNECTOR) Printed Wiring Board .................................................... 5-5 5-6. TIMER Board (FRONT) Printed Wiring Board .............. 5-6 5-7. KEY Board (POWER SWITCH) Printed Wiring Board .................................................... 5-7 6. TROUBLESHOOTING ............................................. 6-1 7. REPAIR PARTS LIST 7-1. Exploded Views ............................................................ 7-1 7-1-1. Case Section ........................................................... 7-1 7-1-2. Mechanism Deck Section ........................................ 7-2 7-1-3. Accessories ............................................................. 7-3 7-2. Electrical Parts List ....................................................... 7-4