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SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, metallized knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
LEAKAGE
The AC leakage from any exposed metal part to earth Ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers). Leak-
age current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM
or battery-operated AC voltmeter. The limit indication is 0.75
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a pas-
sive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
0.15µFTo Exposed Metal
Parts on Set
1.5k-„¦AC
voltmeter
(0.75V)
Earth Ground
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTIONUse of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
-Never reuse a disconnected chip component.
-Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
-Keep the temperature of soldering iron around 270ËšC
during repairing.
-Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
-Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on
the rear exterior.
This caution
label is located
inside the unit.
ATTENTION AU COMPOSANT AYANT RAPPORT
Ã- LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
TABLE OF CONTENTS
1. GENERAL
.................................................................... 3
2. DIAGRAMS
2-1. Circuit Board Location ....................................................... 4
2-2. Block Diagrams .................................................................. 5
2-3. Schematic Diagram -“ CDP Section -“................................. 8
2-4. Schematic Diagram -“ MAIN Section -“.............................. 9
2-5. Schematic Diagram -“ PANEL Section -“.......................... 10
2-6. Schematic Diagram -“ CD-R (1/2) Section -“.................... 11
2-7. Schematic Diagram -“ CD-R (2/2) Section -“.................... 12
2-8. Schematic Diagram -“ Power Section -“............................ 13
2-9. IC Pin Functions ............................................................... 14
3. EXPLODED VIEWS
3-1. Front Panel Section .......................................................... 19
3-2. Chassis Section ................................................................. 20
3-3. CD Play Section ............................................................... 21
3-4. CD Record Section ........................................................... 22
4. ELECTRICAL PARTS LIST ................................. 23
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1Power button
2OPEN/CLOSE A button (DECK A)
3. AMS button (DECK A)
4> AMS button (DECK A)
5. AMS button (DECK B)
6> AMS button (DECK B)
7OPEN/CLOSE A button (DECK B)
8H button (DECK B)
9z REC button
q;REC LEVEL knob (DECK B)
qaX button (DECK B)
qsx button (DECK B)
qdINPUT button (DECK B)
qfTIME button (DECK B) FRONT PANEL
qgERASE button (DECK B)
qhFINALIZE button (DECK B)
qjDISC tray (DECK B)
qkCD SYNCHRO HIGH button
qlCD SYNCHRO NORMAL button
w;DISC tray (DECK A)
wa
remote sensor
wsTIME button (DECK A)
wdRELAY button (DECK A)
wfx button (DECK A)
wgX button (DECK A)
whPHONE jack
wjPHONE LEVEL knob
wkH button (DECK A) LOCATION OF PARTS AND CONTROLS
wk
2 1 3 4 5 6 7
wj
wh
qj qg qh qd qs qf wa w; qlqk wdws wf wg
8
9
0
qa
SECTION 1
GENERAL
