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NW-S4
Network Walkman is trademark of Sony
Corporation.
OpenMG and its logo are trademarks of Sony
Corporation.
WALKMAN is a registered trademark of Sony
Corporation.
Microsoft, Windows, Windows NT, Windows
Media, Windows Millennium Edition and their
logos are trademarks or registered trademarks of
Microsoft Corporation in the United States and/or
other countries.
US and foreign patents licensed from Dolby
Laboratories.
All other trademarks and registered trademarks are
trademarks or registered trademarks of their
respective holders.
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.................................................. 3
2. GENERAL ...................................................................... 8
3. DISASSEMBLY
3-1. Disassembly Flow .............................................................. 9
3-2. Lower Case Assy ................................................................ 9
3-3. Jack Flexible Module,
Jack (Small Type) (Water Proof) (J301) .......................... 10
3-4. MAIN Board .................................................................... 10
3-5. SUB Board ....................................................................... 11
4. DIAGRAMS
4-1. Block Diagram ................................................................. 13
4-2. Note for Printed Wiring Boards and
Schematic Diagrams ........................................................ 14
4-3. Printed Wiring Board -“ MAIN Board -“ ......................... 15
4-4. Schematic Diagram -“ MAIN Board (1/2) -“ ................... 16
4-5. Schematic Diagram -“ MAIN Board (2/2) -“ ................... 17
4-6. Printed Wiring Boards -“ SUB Board -“ .......................... 18
4-7. Schematic Diagram -“ SUB Board -“ ............................... 19
4-8. IC Pin Function Description ............................................ 21
5. EXPLODED VIEWS
5-1. Upper Case Assy .............................................................. 25
5-2. Board Assy ....................................................................... 26
6. ELECTRICAL PARTS LIST ................................ 27Flexible Circuit Board Repairing
- Keep the temperature of the soldering iron around 270 ËšC dur-
ing repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
