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NW-E5
Specifications ............................................................................ 1
1. SERVICING NOTE ....................................................... 2
2. GENERAL ....................................................................... 3
3. DISASSEMBLY
3-1. Chassis ASSY, Case ASSY ......................................... 7
3-2. LID, Case .................................................................... 7
3-3. Main Board, Power Board .......................................... 7
3-4. LCD Unit .................................................................... 8
3-5. Button (Play/Stop), Holder (Knob,Spring),
Knob (FF/REV) .......................................................... 8
4. TEST MODE ................................................................... 9
5. DIAGRAMS
5-1. Block Diagrams ......................................................... 11
5-2. Printed Wiring Boards (Main Section) ..................... 12
5-3. Schematic Diagram (Main Section (1/2)) ................. 13
5-4. Schematic Diagram (Main Section (2/2)) ................. 14
5-5. Printed Wiring Boards (Power Section) ................... 15
5-6. Schematic Diagram (Power Section) ........................ 16
6. EXPLODED VIEW
6-1. Main Section ............................................................. 21
6-2. Case Section ............................................................. 22
7. ELECTRICAL PARTS LIST ................................... 23
Flexible Circuit Board Repairing
- Keep the temperature of the soldering iron around 270°C during
repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
- Replacement of CXD9534BGG (IC710) used in the set requires a special
tool.
r UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40°C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.
SECTION 1
SERVICING NOTE
