Sony mz r37 1 4 service manual

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Ð 2 Ð Battery operation time 1) Batteries Recording 2) Playback Two NC-AA Approx. Approx. nickel-cadmium 3 hours 5 hours rechargeable batteries Two LR6 (size AA) ÐÐÐÐ 3) Approx. Sony alkaline dry batteries 13 hours 1)The battery life may be shorter due to operating conditions and the temperature of the location. 2)When you record, use fully charged rechargeable batteries. 3)Recording time may differ according to the alkaline batteries. Dimensions Approx. 116.8 ´ 18.5 ´ 86.1 mm (w/h/d) (4 5/8 ´ 3/4 ´ 3 1/2 in.) Mass Approx. 160 g (5.6 oz) the recorder only Approx. 220 g (7.8 oz) incl. a recordable MD, and two NC-AA nickel-cadmium rechargeable batteries Supplied accessories Optical cable (1) (MC-918) AC power adaptor (1) (AC-MZR37) Headphones with a remote control (1) (SZR-S17) NC-AA nickel-cadmium rechargeable batteries (2) Rechargeable battery carrying case (1) Design and specifications are subject to change without notice. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing ¥ Keep the temperature of the soldering iron around 270¡C during repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement ¥ Never reuse a disconnected chip component. ¥ Notice that the minus side of a tantalum capacitor may be damaged by heat. Precautions for Laser Diode Emission Check When checking the emission of the laser diode during adjust- ments, never view directly downwards as this may lead to blindness. Precautions for Using Optical Pick-up (KMS-280A) As the laser diode inside the optical pick-up damages by static electricity easily, solder the laser tap of the Optical pick-up flexible board when handling. Also take the necessary measures to prevent damages by static electricity. Handle the Optical pick- up flexible board with care as it breaks easily. Laser tap Optical Pick-up flexible board ATTENTION AU COMPOSANT AYANT RAPPORT Ë LA SƒCURITƒ!! LES COMPOSANTS IDENTIFIƒS PAR UNE MARQUE ! SUR LES DIAGRAMMES SCHƒMATIQUES ET LA LISTE DES PIéCES SONT CRITIQUES POUR LA SƒCURITƒ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIéCES SONY DONT LES NUMƒROS SONT DONNƒS DANS CE MANUEL OU DANS LES SUPPLƒMENTS PUBLIƒS PAR SONY. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. IN NO EVENT SHALL SELLER BE LIABLE FOR ANY DIRECT, INCIDENTAL OR CONSEQUENTIAL DAMAGES OF ANY NATURE, OR LOSSES OR EXPENSES RESULTING FROM ANY DEFECTIVE PRODUCT OR THE USE OF ANY PRODUCT. ÒMD WALKMANÓ is a trademark of Sony Corporation.This MiniDisc player is classi- fied as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the bottom exterior.

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Ð 3 Ð 1. GENERAL Looking at the controls ...................................................... 4 2. SELF-DIAGNOSTIC 2-1. General ............................................................................... 5 2-2. Test Mode Setting .............................................................. 5 2-3. Operation in Test Mode Setting ......................................... 5 2-4. Releasing the Test Mode .................................................... 5 2-5. Self-Diagnostic Mode ........................................................ 5 2-6. Clearing the Error Indication Code and Total Recording Time .................................................. 6 3. DISASSEMBLY 3-1. Panel, Bottom ..................................................................... 7 3-2. Panel (SV) Assy, Front ....................................................... 7 3-3. LCD Module ...................................................................... 8 3-4. Connector ........................................................................... 8 3-5. Main Board ........................................................................ 9 3-6. Panel (SV) Assy, Upper ..................................................... 9 3-7. Cabinet (SV) Assy ........................................................... 10 3-8. OP Block Assy ................................................................. 10 3-9. Holder Assy ...................................................................... 11 TABLE OF CONTENTS 4. TEST MODE 4-1. General ............................................................................. 12 4-2. Test Mode Setting ............................................................ 12 4-3. Test Mode Structure ......................................................... 12 4-4. Manual Mode ................................................................... 12 4-5. Overall Adjustment Mode (Assy Mode) .......................... 15 4-6. Hybrid Mode, Key Check Mode ...................................... 16 5. ELECTRICAL ADJUSTMENTS ........................... 17 6. DIAGRAMS 6-1. IC Pin Descriptions .......................................................... 20 6-2. Block Diagram Ð Servo Section Ð .................................... 25 6-3. Block Diagram Ð Audio Section Ð ................................... 27 6-4. Block Diagram Ð System Control Section Ð .................... 29 6-5. Printed Wiring Board ....................................................... 31 6-6. Schematic Diagram Ð Main Section (1/3) Ð ..................... 35 6-7. Schematic Diagram Ð Main Section (2/3) Ð ..................... 38 6-8. Schematic Diagram Ð Main Section (3/3) Ð ..................... 41 7. EXPLODED VIEWS 7-1. Panel Section .................................................................... 49 7-2. Cabinet (SV) Assy Section .............................................. 50 7-3. Mechanism Deck Section ................................................ 51 8. ELECTRICAL PARTS LIST ................................... 52 SERVICING NOTE 1) When repairing this device with the power on, if you remove the main board or open the upper panel assy, this device stops working. In this case, you can work without the device stopping by fastening the hook of the OPEN1 switch (S801) with tape. 2) This set is designed to perform automatic adjustment for each adjustment and write its value to EEPROM. Therefore, when EEPROM (IC803) has been replaced in service, be sure to per- form automatic adjustment and write resultant values to the new EEPROM. Refer to page 12 for details. panel assy, uppe r MAIN board tape S801