Sony mz nh 1 service manual

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2 MZ-NH1 DimensionsApprox. 81.7 × 76.1 × 14.8 mm (w/h/d) (31/4 × 3 × 19/32 in.) (excluding projecting parts and controls) MassApprox. 97 g (3.4 oz) (the recorder only) Approx. 107 g (3.8 oz) (including the rechargeable battery) 1)The LINE IN (OPT) jack is used to connect either a digital (optical) cable or a line (analog) cable. 2)The i/LINE OUT jack connects either headphones/earphones or a line cable. Design and specifications are subject to change without notice. Your dealer may not handle some of the above listed accessories. Please ask the dealer for detailed information about the accessories in your country. When using optional headphones, use only headphones/earphones with stereo mini plugs. You cannot use headphones/ earphones with micro plugs. 4)When using a 100% fully charged lithium-ion rechargeable battery 3)Measured in accordance with the JEITA (Japan Electronics and Information Technology Industries Association) standard. On power sources Use house current or rechargeable battery. For use in your house: For the supplied battery charging stand, use the AC power adaptor supplied with this recorder. Do not use any other AC power adaptor since it may cause the recorder to malfunction. Polarity of the plug MD mode (Unit: approx.hours)(JEITA) When SP StereoLP2 StereoLP4 Stereo Recording continuously81010.5 Playing continuously14.5 17 18.5

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3 MZ-NH1 TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 4 2. GENERAL ................................................................... 5 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 7 3-2. Bottom Panel Sub Assy ................................................... 7 3-3. MAIN Board .................................................................... 8 3-4. Upper Panel Sub Assy ..................................................... 8 3-5. Control Ornament Block ................................................. 9 3-6. Mechanism Deck Assy (MT-MZNH1-181) .................... 9 3-7. Gear (SA), Gear (SB) ...................................................... 10 3-8. Op Service Assy .............................................................. 10 3-9. DC SSM18D/C-NP Motor (Spindle) (M701), DC SSM21A/C-NP Motor (Sled) (M702), DC Motor Unit (Over Write Head Up/Down) (M703) ... 11 3-10. Holder Assy ..................................................................... 11 4. TEST MODE ............................................................... 12 5. ELECTRICAL ADJUSTMENT ............................. 16 6. DIAGRAMS 6-1. Block Diagram -“MD SERVO Section -“ ......................... 21 6-2. Block Diagram -“AUDIO Section -“ ................................. 22 6-3. Block Diagram -“POWER SUPPLY Section -“ ................ 23 6-4. Schematic Diagram -“MAIN Section (1/9) -“ ................... 25 6-5. Schematic Diagram -“MAIN Section (2/9) -“ ................... 26 6-6. Schematic Diagram -“MAIN Section (3/9) -“ ................... 27 6-7. Schematic Diagram -“MAIN Section (4/9) -“ ................... 28 6-8. Schematic Diagram -“MAIN Section (5/9) -“ ................... 29 6-9. Schematic Diagram -“MAIN Section (6/9) -“ ................... 30 6-10. Schematic Diagram -“MAIN Section (7/9) -“ ................... 31 6-11. Schematic Diagram -“MAIN Section (8/9) -“ ................... 32 6-12. Schematic Diagram -“MAIN Section (9/9) -“ ................... 33 6-13. Printed Wiring Board -“MAIN Section (1/2) -“ ................ 34 6-14. Printed Wiring Board -“MAIN Section (2/2) -“ ................ 35 7. EXPLODED VIEWS 7-1. PANEL SECTION ........................................................... 49 7-2. MAIN SECTION ............................................................ 50 7-3. MECHANISM DECK SECTION ................................... 51 8. ELECTRICAL PARTS LIST ................................ 52Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 ËšC during repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.