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MZ-NF520D
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
-Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
-K eep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C .
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
1. SERVICING NOTES ....................................................... 4
2. GENERAL ........................................................................\
.. 5
3. DISASSEMBLY
3-1. Disassembly Flow.......................................................... 6
3-2. Case (Low er).................................................................. 7
3-3. MAIN Board ................................................................... 7
3-4. Panel (Upper) Section.................................................... 8
3-5. LCD Module, Button (Control)..................................... 8
3-6. Mechanism Deck (MT-MZN710-177).......................... 9
3-7. Set Chassis Assy............................................................. 9
3-8. OP Service Assy (LCX-5R) ......................................... 10
3-9. Holder Assy .................................................................. 11
3-10. DC Motor (Sled) (M602)........................................... 11
3-11. DC Motor (Over Write Head Up/Down) (M603), DC SSM18B Motor (Spindle) (M601)...................... 12
4. TEST MODE .................................................................... 13
5. ELECTRICAL ADJUSTMENTS ............................... 18
6. DIAGRAMS
6-1. Block Diagram ............................................................. 37
6-2. Printed Wiring Board - MAIN Board (Side A)........... 39
6-3. Printed Wiring Board - MAIN Board (Side B)........... 40
6-4. Schematic Diagram - MAIN Board (1/4).................... 41
6-5. Schematic Diagram - MAIN Board (2/4).................... 42
6-6. Schematic Diagram - MAIN Board (3/4).................... 43
6-7. Schematic Diagram - MAIN Board (4/4).................... 44
6-8. IC Pin Function Description........................................ 49
7. EXPLODED VIEWS
7-1. Case Section ................................................................. 55
7-2. Chassis Section ............................................................. 56
7-3. MAIN Board Section................................................... 57
7-4. Mechanism Deck Section-1 (MT-MZN710-177) ........ 58
7-5. Mechanism Deck Section-2 (MT-MZN710-177) ........ 59
8. ELECTRICAL PARTS LIST ....................................... 60
TABLE OF CONTENTS
