Sony mz n 910 service manual

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2 MZ-N910 CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Notes on chip component replacement -Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -K eep the temperature of the soldering iron around 270 ËšC dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 ËšC higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ËšC . Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. -For use in your house: For the supplied battery charging stand, use the AC power adaptor supplied with this recorder. Do not use any other AC power adaptor since it may cause the recorder to malfunction Polarity of the plug SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Optical cable (1) CD-ROM (SonicStage Ver. 1.5) (1)* Carrying pouch/carrying case with a belt clip (1) -ˆ—Do not play a CD-ROM on an audio CD player. Headphones/earphones with a remote control (1) DimensionsApprox. 78.9 × 72.2 × 15.9 mm (w/h/d) (31/8 7 /832 × 2 × 21 / in.) (excluding projecting parts and controls ) MassApprox. 93 g (3.3 oz) 1)The LINE IN (OPT) jack is used to connect either a digital (optical) cable or a line (analog) cable. 2)The i/LINE OUT jack connects either headphones/earphones or a line cable. 3)Measured in accordance with JEITA. Design and specifications are subject to change without notice.4)Measured in accordance with the JEITA (Japan Electronics and Information Technology Industries Association) standard. Supplied accessoriesAC power adaptor (1) Battery charging stand (1) NH-14WM Nickel metal hydride rechargeable battery (1) Dry battery case (1) Battery carrying case (1)

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3 MZ-N910 1. SERVICING NOTES ................................................... 4 2. GENERAL ...................................................................... 5 3. DISASSEMBLY 3-1. Bottom Panel Block Assy........................................... 7 3-2. Upper Lid Bloc k Assy................................................ 7 3-3. LCD Module ............................................................... 8 3-4. MAIN Board, Case (battery)...................................... 8 3-5. MD Mechanism Deck (MT-MZN910-181), Set Chassis .................................................................. 9 3-6. Case (battery) ............................................................. 9 3-7. Gear (BSA), Gear (SB)............................................ 10 3-8. OP Service Assy (ABX-1R) ..................................... 10 3-9. DC Motor SSM22A (sled) (M602), DC Motor SSM18D (spindle) (M601), DC Motor Unit (over write head up/down) (M603) .......................... 11 3-10. Holder Assy ............................................................ 11 4. TEST MODE ................................................................ 12 5. ELECTRICAL ADJUSTMENTS ........................... 18 6. DIAGRAMS 6-1. Block Diagram ......................................................... 37 6-2. Note for Printed Wiring Board and Schematic Diagrams ................................................. 38 6-3. Printed Wiring Board -“ MAIN Board (Side A) -“........................................ 39 -“ MAIN Board (Side B) -“........................................ 40 6-4. Schematic Diagrams -“ MAIN Board (1/4) -“.............................................. 41 -“ MAIN Board (2/4) -“.............................................. 42 -“ MAIN Board (3/4) -“.............................................. 43 -“ MAIN Board (4/4) -“.............................................. 44 6-5. IC Pin Function Description.................................... 50 7. EXPLODED VIEWS 7-1. Case Section ............................................................. 56 7-2. Chassis Section ......................................................... 57 7-3. MAIN Board Section............................................... 58 7-4. MD Mec hanism Deck Section (MT-MZN910-181) . 59 8. ELECTRICAL PARTS LIST ................................... 60 TABLE OF CONTENTS