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MZ-M200
2
Recording and playback timeList of the recording time for each disc (Approx.)The recording time is varied depending on disc type, disc mode, codec, and bit rate.
When using a disc in Hi-MD mode
When recording on the recorder Recording time 1)
Codec/
Bit rateRecording mode
on the recorder1GB Hi-MD
disc80-minute
standard disc 74-minute
standard disc60-minute
standard disc
LinearPCM/
1.4 Mbps PCM 1 hour and
34 minutes28 minutes 26 minutes 21 minutes
A TRAC
ATRAC3plus /
256 kbps Hi-SP 7 hours and
55 minutes2 hours and
20 minutes 2 hours and
10 minutes1 hour and
40 minutes
A TRAC3plus /
64 kbps Hi-LP 34 hours 10 hours and
10 minutes9 hours and
20 minutes7 hours and
40 minutes
When transferring from the computer Recording time 1)
Codec/Bit rate 1GB Hi-MD
disc80-minute
standard disc 74-minute
standard disc60-minute
standard disc
LinearPCM/1.4 Mbps 1 hour and
34 minutes28 minutes 26 minutes 21 minutes
A TRAC
ATRAC3plus /352 kbps 5 hours and
30 minutes1 hour and
35 minutes 1 hour and
30 minutes1 hour and
10 minutes
A TRAC3plus /256 kbps 7 hours and
55 minutes2 hours and
20 minutes 2 hours and
10 minutes1 hour and
40 minutes
A TRAC3plus /192 kbps 11 hours 3 hours and
10 minutes3 hours 2 hours and
20 minutes
A TRAC3plus /64 kbps 34 hours 10 hours and
10 minutes9 hours and
20 minutes7 hours and
40 minutes
A TRAC3plus /48 kbps 45 hours 13 hours and
30 minutes12 hours and
30 minutes10 hours
A TRAC3 /132 kbps 16 hours and
30 minutes4 hours and
50 minutes 4 hours and
30 minutes3 hours and
40 minutes
A TRAC3 /105 kbps 20 hours and
40 minutes6 hours and
10 minutes 5 hours and
40 minutes4 hours and
40 minutes
A TRAC3 /66 kbps 32 hours and
40 minutes9 hours and
50 minutes 9 hours 7 hours and
20 minutes
MP3
2)/128 kbps 17 hours 5 hours 4 hours and 30 minutes3 hours and
30 minutes
1) When transferring 4-minute tracks
2) MP3 file formats are as follows: MPEG-1 Audio Layer-3/sampling fre\
quency 44.1 kHz/fixed bit rate.
RevolutionsApprox. 350 rpm to 3,600 rpm (CLV)
Error correctionHi-MD: LDC (Long Distance Code)/BIS (Burst Indicator Subcode)
MD: ACIRC (Advanced Cross Interleave Reed Solomon Code)
Sampling frequency44.1 kHz
Sampling rate converterOptical (digital) input: 32 kHz/44.1 kHz/48 kHz
Audio formats supported by this recorderRecording:
LinearPCM (44.1 kHz/16 bit)
A
TRAC3plus (Hi-SP, Hi-LP)
A TRAC3 (LP2, LP4)
A TRAC (SP)
Playback:
LinearPCM
A TRAC3plus
A TRAC3
A TRAC
MP3 (for playback only) (MPEG-1 Audio Layer-3, sampling frequency 32/44.1/48 kHz, bit rate
32-320 kbps (fixed/variable bit rate))
A TRAC stands for Adaptive TRansform Acoustic Coding .
Modulation systemHi-MD: 1-7RLL (Run Length Limited)/PRML (Partial Response Maximum Lik\
elihood)
MD: EFM (Eight to Fourteen Modulation)
Frequency response (During digital and analog input)20 to 20,000 Hz ±3 dB
Input connectors*MIC (PLUG IN POWER): stereo mini-jack (minimum input level 0.13 mV)
LINE IN (OPT): stereo mini-jack for analog input (minimum input level\
49 mV)/optical (digital)
mini-jack for optical (digital) input
Output connectori/LINE OUT: stereo mini-jack (dedicated remote jack) / regulated output\
194 mV (10 k -)
Maximum output (DC)Headphones:
5 mW + 5 mW (16 -)
Power requirementsSony AC Power Adaptor DC 5 V AC 100 V - 240 V, 50/60 HzLithium-ion rechargeable battery
LIP-4WM, 3.7 V, 370 mAh, Li-ion
Operating temperature+5 °C (+41 °F) to +35 °C (+95 °F)
Battery operation time**
Dimensions
Approx. 83.8 × 84.4 × 14.7 mm (w/h/d)
(33/8 3/8 19/32 in.) (excluding projecting parts and controls)
MassApprox. 96 g (3.4 oz.) (the recorder only)
Approx. 106 g (3.8 oz.) (including the rechargeable battery)
* The LINE IN (OPT) jack is used to connect either a digital (optical)\
cable or a line (analog) cable.
** Measured in accordance with JEITA.
Design and specifications are subject to change without notice.
Battery life 1)
This value varies depending on how the recorder is used.
When recording/playing continuously in Hi-MD mode (Unit: approx. hours)
When Disc type LinearPCM Hi-SP Hi-LP MP3 2)
Recording 1GB Hi-MD disc 6 9 10.5 - 3)
60/74/80-minute
standard disc 59
10.5 - 3)
Playing 1GB Hi-MD disc 10 15.5 19 16.5
60/74/80-minute
standard disc 8
14.5 18.5 16
When recording/playing continuously in MD mode (Unit: approx. hours)
When Disc type SP LP2 LP4Recording 60/74/80-minute standard disc 8.5 10.5 12
Playing 60/74/80-minute standard disc 15.5 17.5 19
Measured in accordance with the JEITA (Japan Electronics and Information Technology Industries
Association) standard.
1) Measured using a fully charged lithium-ion rechargeable battery with EL Light in the menu set to Auto Off 2) When transferring at 128 kbps3) The recorder cannot record in MP3 mode. Transfer MP3 audio data using the supplied SonicStage software
NoteRepeated recharging causes the capacity of the rechargeable battery to decrease over time. As a result, the battery
life will become shorter as the battery is used. Please replace the batt\
ery when the battery life reaches about half
the time listed above.
× 3 ×
Supplied accessories- AC power adaptor (100 V - 240 V)
- AC power cord 1)
- USB cable
- Remote control 2) - Earphones
- LIP-4WM Lithium-ion rechargeable battery
- Rechargeable battery case
- Stereo microphone
4) - Carrying pouch
- Ferrite core (small size)
- One
- 1GB Hi-MD disc
- CD-ROM
3)
(Windows: SonicStage/MD Simple Burner, Macintosh: Hi-MD Music Transfer \
for Mac)
- Operating Instructions (this manual)
- Operating Instructions (Hi-MD Music Transfer for Mac)
1) The shape of the plug differs according to the region where the recorder\
was purchased.
Two cords with differently shaped plugs are supplied with the models for\
Europe, Asia and Chile.
Use the one that corresponds with the outlet configuration in the regi\
on where it is used.
2) Remote with a ferrite core is supplied.3) Do not play a CD-ROM on an audio CD player.
For details on Hi-MD Music Transfer for Mac, refer to the instru\
ction sheet supplied with this
recorder.
4) MIC with a ferrite core is supplied.
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MZ-M200
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TABLE OF CONTENTS
1. SERVICING NOTES
............................................... 4
2. GENERAL ................................................................... 5
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 6
3-2. Panel (Lower) Section ..................................................... 6
3-3. Cabinet (Front) Section ................................................... 7
3-4. MAIN Board .................................................................... 7
3-5. Panel (Upper) Assy .......................................................... 8
3-6. Mechanism Deck (MT-MZRH1-181) ............................. 8
3-7. Torsion Spring (Pop Up L), Torsion Spring (Pop Up R) .............................................. 9
3-8. Gear (SA), Gear (SB) ...................................................... 9
3-9. OP Service Assy (ABX-U2) ............................................ 10
3-10. DC Motor SSM18D/C-NP (Spindle) (M701), DC Motor (Sled) (M702),
DC Motor Unit (Over Write Head Up/Down) (M703) ... 10
3-11. Holder Assy ..................................................................... 11
3-12. Position of Ferrite Core ................................................... 11
4. TEST MODE .............................................................. 12
5. ELECTRICAL ADJUSTMENTS ......................... 16
6. DIAGRAMS
6-1. Block Diagram - SERVO Section - ................................ 21
6-2. Block Diagram - AUDIO Section - ................................ 22
6-3. Block Diagram - POWER SUPPLY Section - ............... 23
6-4. Schematic Diagram - MAIN Board (1/7) - .................... 25
6-5. Schematic Diagram - MAIN Board (2/7) - .................... 26
6-6. Schematic Diagram - MAIN Board (3/7) - .................... 27
6-7. Schematic Diagram - MAIN Board (4/7) - .................... 28
6-8. Schematic Diagram - MAIN Board (5/7) - .................... 29
6-9. Schematic Diagram - MAIN Board (6/7) - .................... 30
6-10. Schematic Diagram - MAIN Board (7/7) - .................... 31
6-11. Printed Wiring Board - MAIN Board (Component Side) - ............................... 32
6-12. Printed Wiring Board - MAIN Board (Conductor Side) - ................................. 33
6-13. Printed Wiring Board - OLED Board - .......................... 34
6-14. Schematic Diagram - OLED Board - ............................. 35
6-15. Printed Wiring Board - AMP Board - ............................ 36
6-16. Schematic Diagram - AMP Board - ............................... 36
7. EXPLODED VIEWS
7-1. Panel (Upper) Section ..................................................... 54
7-2. Cabinet (Front) Section ................................................... 55
7-3. Lower Panel Section ........................................................ 56
7-4. Set Chassis Section .......................................................... 57
7-5. MAIN Board Section ....................................................... 58
7-6. Mechanism Deck Section (MT-MZRH1-181) ................ 59
7-7. Microphone Section (ECM-DS70P) ............................... 60
8. ELECTRICAL PARTS LIST ................................ 61
Notes on chip component replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ˚C
during repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
e xposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
- LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
