Sony mz e33

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Ð 2 Ð 1. SERVICING NOTE ....................................................... 3 2. GENERAL ....................................................................... 4 3. DISASSEMBLY 3-1. Bottom Panel Assy .............................................................. 5 3-2. Upper Panel Assy ................................................................ 5 3-3. Main Board ......................................................................... 6 3-4. MD Assy ............................................................................. 6 3-5. OP Service Assy .................................................................. 6 4. TEST MODE ................................................................... 7 5. ELECTRICAL ADJUSTMENTS ............................ 11 6. DIAGRAMS 6-1. IC Pin Description ............................................................. 13 6-2. Block Diagram .................................................................. 15 6-3. Printed Wiring Board ........................................................ 18 6-4. Schematic Diagram ........................................................... 21 7. EXPLODED VIEWS 7-1. Panel Section ..................................................................... 29 7-2. Main Board Section .......................................................... 30 7-3. Mechanism Deck Section .................................................. 31 8. ELECTRICAL PARTS LIST .................................... 32 TABLE OF CONTENTS Flexible Circuit Board Repairing ¥ Keep the temperature of the soldering iron around 270°C during repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement ¥ Never reuse a disconnected chip component. ¥ Notice that the minus side of a tantalum capacitor may be dam- aged by heat. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. IN NO EVENT SHALL SELLER BE LIABLE FOR ANY DIRECT, INCIDENTAL OR CONSEQUENTIAL DAMAGES OF ANY NATURE, OR LOSSES OR EXPENSES RESULTING FROM ANY DEFECTIVE PRODUCT OR THE USE OF ANY PRODUCT. ÒMD WALKMANÓ is a trademark of Sony Corporation.This MiniDisc player is classi- fied as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT label is located on the bottom exterior. Mass Approx. 113 g (4.0 oz.) the player only Approx. 155 g (5.5 oz.) incl. a premastered MD and a Sony alkaline LR6 (SG) battery Supplied accessories AC power adaptor AC-MZR55 (1) R-6 sized Ni-MH rechargeable battery NH-MDAA (1) Rechargeable battery carrying case (1) Headphones with a remote control MDR-A34SP + RM-MZE33 (1) (US model) MDR-E805SP + RM-MZE33 (1) (Canadian, AEP, E model) MDR-E838SP + RM-MZE33 (1) (Hong Kong model) Carrying pouch (1) Design and specifications are subject to change without notice. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.ATTENTION AU COMPOSANT AYANT RAPPORT Ë LA SƒCURITƒ!! LES COMPOSANTS IDENTIFIƒS PAR UNE MARQUE ! SUR LES DIAGRAMMES SCHƒMATIQUES ET LA LISTE DES PIéCES SONT CRITIQUES POUR LA SƒCURITƒ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIéCES SONY DONT LES NUMƒROS SONT DONNƒS DANS CE MANUEL OU DANS LES SUPPLƒMENTS PUBLIƒS PAR SONY.

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Ð 3 Ð SECTION 1 SERVICING NOTE 1. When repairing this de vice with the po wer on, if y ou remo ve the main boar d, this de vice stops w orking. In this case , y ou w ork without the de vice stopping b y fastening the hook of the DOOR OPEN/CLOSE s witc h (S801) with tape . S801 2. The electrical components diff er accor ding to the ver sion of the system contr ol IC (IC801). When replacing the IC801, c hec k its model name and ad d or remo ve D1001 and/or R1001 as sho wn belo w. For detailed inf ormation, see the Printed Wiring Boar d on pa g e 18 and the Schematic Diagram on page 21. RU6815MF-0004 (V er . 3.0) .... Ad d D1001 and R1001 RU6815MF-0005 (V er . 3.2) and later .... Remo ve D1001 and R1001