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Flexible Circuit Board Repairing
-Keep the temperature of the soldering iron around 270°C
during repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be
damaged by heat.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
r adiation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL
OR IN SUPPLEMENTS PUBLISHED BY SONY.
MZ-E510
On power sources
- Use house current, LR6 (size AA) battery, or car battery.
- For use in your house: Use the AC power adaptor supplied with
this recorder. Do not use any other AC power adaptor since it
may cause the recorder to malfunction.
- Connect the AC power adaptor to an easily accessible AC outlet.
Should you notice an abnormality in the AC power adaptor,
disconnect it from the AC outlet immidiately.
- The recorder is not disconnected from the AC power source
(mains) as long as it is connected to the wall outlet, even if the
recorder itself has been turned off.
- If you are not going to use this recorder for a long time, be sure
to disconnect the power supply (AC power adaptor, dry battery,
or car battery cord). To remove the AC power adaptor from the
wa ll outlet, grasp the adaptor plug itself; n ever pull the cord.
Polarity of the
plug
*Replacement of IC501, IC601 used in this set requires a
special tool.
- The voltage and waveform of CSP (chip size package) can-
not be measured, because its lead layout is different from
that of conventional IC.
- Lead layouts
Unleaded solder
Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40°C higher
than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to
about 350°C. Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
surface
Lead layout of
conventional IC CSP (chip size package)
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TABLE OF CONTENTS
MZ-E510
1. SERVICING NOTE ......................................................... 4
2. GENERAL ........................................................................\
. 5
3. DISASSEMBLY
3-1. Upper Panel, Holder Assy ............................................. 6
3-2. Mechanism Deck (MT-MZE710-183) ........................... 7
3-3. MAIN Board, Bracket (L) Assy, Bracket (R) Assy ....... 7
3-4. OP Service Assy (ABX-1E) .......................................... 8
4. TEST MODE .............................................................. 9
5. ELECTRICAL ADJUSTMENTS ............................. 14
6. DIAGRAMS
6-1. Block Diagrams ........................................................... 27
6-2. Printed Wiring Boards - MAIN Board (Side A) - ........ 28
6-3. Printed Wiring Boards - MAIN Board (Side B) - ........ 29
6-4. Schematic Diagrams - MAIN Board (1/4) - ................ 30
6-5. Schematic Diagrams - MAIN Board (2/4) - ................ 31
6-6. Schematic Diagrams - MAIN Board (3/4) - ................ 32
6-7. Schematic Diagrams - MAIN Board (4/4) - ................ 33
6-8. IC Block Diagrams ...................................................... 34
6-9. IC Pin Function Description ........................................ 36
7.EXPLODED VIEWS
7-1. Case Section ................................................................ 40
7-2. Mechanism Deck Section (MT-MZE710-183) ............ 41
8.ELECTRICAL PARTS LIST ...................................... 42
