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MZ-DN430
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed withthe lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Notes on chip component replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 °C
during repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
e
xposure.
T ABLE OF CONTENTS
1. SERVICING NOTES
................................................ 4
2. GENERAL ................................................................... 5
3. DISASSEMBLY
3-1. Case (Lower) ................................................................... 7
3-2. Upper Panel Section ........................................................ 7
3-3. LCD Module, Button (Control) ....................................... 8
3-4. MAIN Board .................................................................... 8
3-5. Mechanism Deck (MT-MZN710-177) ............................ 9
3-6. Set Chassis Assy .............................................................. 9
3-7. OP Service Assy (LCX-5R) ............................................ 10
3-8. Holder Assy ..................................................................... 11
3-9. DC Motor (Sled) (M602) ................................................ 11
3-10. DC Motor (Over Write Head Up/Down) (M603), DC SSM18B Motor (Spindle) (M601) ............................ 12
4. TEST MODE ............................................................... 13
5. ELECTRICAL ADJUSTMENTS .......................... 18
6. DIAGRAMS
6-1. Block Diagram ................................................................ 38
6-2. Printed Wiring Board -“ MAIN Board (Side A) -“ ............ 39
6-3. Printed Wiring Board -“ MAIN Board (Side B) -“ ............ 40
6-4. Schematic Diagram -“ MAIN Board (1/4) -“ .................... 41
6-5. Schematic Diagram -“ MAIN Board (2/4) -“ .................... 42
6-6. Schematic Diagram -“ MAIN Board (3/4) -“ .................... 43
6-7. Schematic Diagram -“ MAIN Board (4/4) -“ .................... 44
7. EXPLODED VIEWS
7-1. Case Section .................................................................... 55
7-2. Chassis Section ................................................................ 56
7-3. MAIN Board Section ....................................................... 57
7-4. Mechanism Deck Section-1 (MT-MZN710-177) ............ 58
7-5. Mechanism Deck Section-2 (MT-MZN710-177) ............ 59
8. ELECTRICAL PARTS LIST .................................. 60
