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Extracted text from sony mz dh 710 service manual (Ocr-read)
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MZ-DH710
Recording and playback timeList of the recording time for each disc
When using a disc in Hi-MD mode
When using a disc in MD modeWhen transferring from
the computerRecording time 1)2)
1)Approximate time2)When transferring 4-minute tracks
Codec/Bit rate 1GB Hi-MD
disc80-minute
standard
disc74-minute
standard
disc60-minute
standard
disc
Linear PCM/1.4Mbps 1 hour and
34 minutes28 minutes 26 minutes 21 minutes
ATRAC3plus/256kbps 7 hours and
55 minutes2 hours and
20 minutes2 hours and
10 minutes1 hour and
40 minutes
AT R AC3plus/64kbps 34 hours 10 hours and
10 minutes9 hours and
20 minutes7 hours and
40 minutes
AT R AC3plus/ 48 kbps 45 hours 13 hours and
30 minutes12 hours and
30 minutes10 hours
AT R AC3/132kbps 16 hours and
30 minutes4 hours and
50 minutes4 hours and
30 minutes3 hours and
40 minutes
AT R AC3/105kbps 20 hours and
40 minutes6 hours and
10 minutes5 hours and
40 minutes4 hours and
40 minutes
AT R AC3/66kbps 32 hours and
40 minutes9 hours and
50 minutes9 hours 7 hours and
20 minutes
MP3/128kbps 17 hours 5 hours 4 hours and
30 minutes3 hours and
30 minutes
When transferring from the
computerRecording time
1)2)
1)Approximate time2)When transferring 4-minute tracks
Codec/Bit rate 80-minute
standard disc74-minute
standard disc60-minute
standard disc
AT R AC(stereo)/292kbps 80 minutes 74 minutes 60 minutes
ATRAC3/132, 105kbps 2 hours and
40 minutes2 hours and
28 minutes2 hours
AT R AC3/66kbps 5 hours and
20 minutes4 hours and
56 minutes4 hours
DimensionsApprox. 83.6 × 29.5 × 77.0 mm (w/h/d)
(33/8 × 13/16 × 31/8 in.)(excluding projecting
parts and controls)
MassApproxSupplied accessoriesEarphones
Dedicated USB cable
CD-ROM (SonicStage/MD Simple Burner)*
Recordable disc
* Do not play a CD-ROM on an audio CD player.. 107 g (3.8 oz.) (the player only)
Design and specifications are subject to change
without notice.
Revolutions350 rpm to 3,000 rpm (CLV)Error correctionHi-MD:
LDC (Long Distance Code)/BIS (Burst
Indicator Subcode)
MD:
ACIRC (Advanced Cross Interleave Reed
Solomon Code)
Sampling frequency44.1 kHzAudio formats supported by this
player
Linear PCM (44.1 kHz/16 bit)
ATRAC3plus (Adaptive TRansform Acoustic
Coding 3 plus)
AT R A C 3
AT R A C
MP3 (MPEG-1 Audio Layer-3/Sampling
frequency 44.1 kHz/Bit rate 32 - 320 kbps
(constant/variable bit rate))
Modulation systemHi-MD:
1-7RLL (Run Length Limited)/PRML
(Partial Response Maximum Likelihood)
MD:
EFM (Eight to Fourteen Modulation)
Frequency response20 to 20,000 Hz ± 3 dBOutputsi: stereo mini-jackMaximum output (DC)Headphones:
5 mW + 5 mW (16 -„¦)
Power requirementsOne LR6 (size AA) alkaline battery (not
supplied)
Operating temperature+5°C (+41°F) to +35°C (+95°F)Battery operation time
When playing continuously in MD mode
(Unit: approx. hours) (JEITA) Battery life
1)
When playing continuously in Hi-MD mode (Unit: approx. hours) (JEITA 2))
1)When using a new Sony LR6 (size AA) alkaline dry battery (produced in Japan)2)Measured in accordance with the JEITA (Japan Electronics and Information Te chnology Industries
Association) standard.
Disc type Linear PCM Hi-SP Hi-LP MP3 3)
3)Tracks transferred at 128 kbps.
1GB Hi-MD disc 9.5 16.5 19.5 19.0 60/74/80-minute
standard disc 8.5 16.0 19.0 18.5
Disc type
SPLP2 LP4
60/74/80-minute
standard disc 18.0 21.5 23.5
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MZ-DH710
Notes on chip component replacement
-Never reuse a disconnected chip component.
-Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
-Keep the temperature of the soldering iron around 270 ËšC
during repairing.
-Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
-Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
TABLE OF CONTENTS
1. SERVICING NOTES
............................................... 4
2. GENERAL ................................................................... 5
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 6
3-2. Case (Lower) Section ...................................................... 7
3-3. MAIN Board .................................................................... 7
3-4. Case (Upper) Section ....................................................... 8
3-5. Mechanism Deck Section (MT-MZNH900-181),
MD Standard Pin ............................................................. 8
3-6. Set Chassis Assy .............................................................. 9
3-7. Gear (BSA), Gear (SB) ................................................... 9
3-8. OP Service Assy .............................................................. 10
3-9. DC Motor SSM18D/C-NP (Spindle) (M701),
DC Motor (Sled) (M702),
DC Motor Unit (Over Write Head Up/Down) (M703) ... 10
3-10. Holder Assy ..................................................................... 11
3-11. Position of Ferrite Core ................................................... 11
4. TEST MODE .............................................................. 12
5. ELECTRICAL ADJUSTMENTS .......................... 16
6. DIAGRAMS
6-1. Block Diagram -“ MD SERVO Section -“ ........................ 21
6-2. Block Diagram -“ POWER SUPPLY Section -“ ............... 22
6-3. Printed Wiring Board -“ MAIN Section (1/2) -“ ............... 24
6-4. Printed Wiring Board -“ MAIN Section (2/2) -“ ............... 25
6-5. Schematic Diagram -“ MAIN Section (1/8) -“ .................. 26
6-6. Schematic Diagram -“ MAIN Section (2/8) -“ .................. 27
6-7. Schematic Diagram -“ MAIN Section (3/8) -“ .................. 28
6-8. Schematic Diagram -“ MAIN Section (4/8) -“ .................. 29
6-9. Schematic Diagram -“ MAIN Section (5/8) -“ .................. 30
6-10. Schematic Diagram -“ MAIN Section (6/8) -“ .................. 31
6-11. Schematic Diagram -“ MAIN Section (7/8) -“ .................. 32
6-12. Schematic Diagram -“ MAIN Section (8/8) -“ .................. 33
7. EXPLODED VIEWS
7-1. Case (Lower) Section ...................................................... 44
7-2. Case (Upper) Section ....................................................... 45
7-3. Chassis Section ................................................................ 46
7-4. Mechanism Deck Section (MT-MZNH900-181) ............ 47
8. ELECTRICAL PARTS LIST ................................ 48
ATTENTION AU COMPOSANT AYANT RAPPORT
Ã- LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.