Sony mv 65 st service manual

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2 MV-65ST Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 °C dur- ing repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. About discs this player can play This player can play the following discs: -DVD -DVD-R -DVD-RW -Video CD -Audio CD -CD-R/CD-RW Disc type Label on the disc DVD Videos Video CDs Audio CDs MP3 files/ JPEG files DVD VIDEO, DVD-R and DVD-RW are trademarks. On power sources -Use house current or car battery (12 V DC). -For use in your house, use the AC power adaptor supplied with the player. Do not use any other AC power adaptor since it may cause the player to malfunction. Polarity of the plug Notes on CD-Rs (recordable CDs)/ CD-RWs (rewritable CDs) -Some CD-Rs/CD-RWs (depending on the equipment used for its recording or the condition of the disc) may not play on this player. - You cannot play a CD-R/CD-RW that is not finalized*. - You cannot play a CD-R/CD-RW that is recorded in Multi Session. - You can play MP3/JPEG files recorded on CD-ROMs, CD-Rs, and CD-RWs. *A process necessary for a recorded CD-R/CD-R W disc to be played on the audio CD player. This label is located on the bottom of the chassis. CAUTION INVISIBLE DO NOT STARE INTO BEAM OR VIEW DIRECTLY WITH OPTICAL INSTRUMENTSLASER RADIATION WHEN OPEN This label is located on the drive units internal chassis. ATTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

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3 MV-65ST TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 3 2. GENERAL Location of Controls....................................................... 4 3. DISASSEMBLY 3-1. Disassembly Flow........................................................... 7 3-2. Base (Monitor) Assy....................................................... 8 3-3. Cabinet (Front) Assy....................................................... 8 3-4. Monitor Assy................................................................... 9 3-5. Hinge............................................................................... 10 3-6. MONITOR Board........................................................... 10 3-7. Liquid Crystal Display Panel (LCD1)............................ 11 3-8. DVD MD Assy................................................................ 11 3-9. SERVO Board, Mechanism Deck................................... 12 3-10. TD-S-Top-Cover............................................................. 12 3-11. Loading Mechanism Assy............................................... 13 3-12. Traverse Mechanism Assy.............................................. 13 4. TEST MODE .............................................................. 14 5. ELECTRICAL ADJUSTMENTS ......................... 15 6. DIAGRAMS 6-1. Block Diagram -“ AUDIO Section -“............................... 18 6-2. Block Diagram -“ VIDEO, PANEL Section -“................ 19 6-3. Block Diagram -“ POWER Section -“.............................. 20 6-4. Note for Printed Wiring Boards and Schematic Diagrams................................................ 21 6-5. Printed Wiring Board -“ MONITOR Board (Side A) -“...................................... 22 6-6. Printed Wiring Board -“ MONITOR Board (Side B) -“...................................... 23 6-7. Schematic Diagram -“ MONITOR Board (1/4) -“........... 24 6-8. Schematic Diagram -“ MONITOR Board (2/4) -“........... 25 6-9. Schematic Diagram -“ MONITOR Board (3/4) -“........... 26 6-10. Schematic Diagram -“ MONITOR Board (4/4) -“........... 27 6-11. Printed Wiring Board -“ KEY Board -“............................ 28 6-12. Schematic Diagram -“ KEY Board -“.............................. 29 6-13. Schematic Diagram -“ POWER Section (1/2) -“.............. 30 6-14. Schematic Diagram -“ POWER Section (2/2) -“.............. 31 6-15. Printed Wiring Board -“ POWER Board (Side A) -“....... 32 6-16. Printed Wiring Board -“ POWER Board (Side B) -“....... 33 6-17. Printed Wiring Board -“ AMP Section -“......................... 34 7. EXPLODED VIEWS 7-1. Overall Section................................................................ 46 7-2. Cabinet (Front) Section................................................... 47 7-3. Base (Monitor) Section................................................... 48 7-4. Monitor Section............................................................... 49 7-5. Cabinet (Lower) Section-1.............................................. 50 7-6. Cabinet (Lower) Section-2.............................................. 51 7-7. Mechanism Deck Section-1............................................ 52 7-8. Mechanism Deck Section-2............................................ 53 7-9. Mechanism Deck Section-3............................................ 54 8. ELECTRICAL PARTS LIST............................ 55 NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. -Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! -Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges oc- cur such as on IC pins, etc. -Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. For E model NTSC type and PAL type. The type of an NTSC system and the type of a PAL system exist in E model. Please refer to the following figure about how to recognize. NTSC: NTSC TYPE PAL: PAL TYPE -“ BACK VIEW -“ SECTION 1 SERVICING NOTES