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MEX-BT2500
Notes on chip component replacement
-Never reuse a disconnected chip component.
-Notice that the minus side of a tantalum capacitor may be
damaged by heat. CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
This label is located on the bottom of the - AEP, UK and E models:
chassis.
Flexible Circuit Board Repairing
-Keep the temperature of the soldering iron around 270 ËšC
during repairing.
-Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
-Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
Ã- LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
Wireless CommunicationCommunication System:
Bluetooth Standard version 2.0
Output:
Bluetooth Standard Power Class 2 (Max. +4 dBm)
Maximum communication range:
Line of sight approx. 10 m (32.8 ft)*
1 Frequency band:
2.4 GHz band (2.4000 -“ 2.4835 GHz)
Modulation method: FHSS
Compatible Bluetooth Profiles*
2:
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
HFP (Handsfree Profile) 1.0
HSP (Headset Profile)
*1The actual range will vary depending on factors
such as obstacles between devices, magnetic
fields around a microwave oven, static electricity,
reception sensitivity, antenna's perfomance,
operating system, software application, etc.
*2Bluetooth standard profiles indicate the purpose of
Bluetooth communication between devices.
Power amplifier sectionOutputs: Speaker outputs (sure seal connectors)
Speaker impedance: 4 -“ 8 ohms
Maximum power output: 52 W × 4 (at 4 ohms)
GeneralOutput:
Power antenna (aerial) relay control terminal
Inputs:
Antenna (aerial) input terminal
AUM input jack (stereo mini jack)
Tone controls:
Low: ±10 dB at 100 Hz (XPLOD)
High: ±10 dB at 10 kHz (XPLOD)
Loudness:
+ 9 dB at 100 Hz
+ 5 dB at 10 kHz
Power requirements: 12 V DC car battery
(negative ground (earth))
Dimensions: Approx. 178 × 50 × 179 mm
(7
1/8 × 2 × 7 1/8 in) (w/h/d)
MWTuning range:
531 -“ 1,602 kHz (at 9 kHz step)
530 -“ 1,710 kHz (at 10 kHz step)
MW tuning interval: 9kHz/10kHz switchable
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: 30 µV
SWTuning range:
SW1: 2,940 -“ 7,735 kHz
SW2: 9,500 -“ 18,135 kHz
(except for 10,140 -“ 11,575 kHz)
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: 30 µV Intermediate frequency: 10.7 MHz/450 kHz
Usable sensitivity: 9 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono)
Harmonic distortion at 1 kHz: 0.5 % (stereo),
0.3 % (mono)
Separation: 35 dB at 1 kHz
Frequency response: 30 -“ 15,000 Hz
Mounting dimensions: Approx. 182 × 53 × 162 mm
(7
1/4 × 2 1/8 × 6 1/2 in) (w/h/d)
Mass: Approx. 1.2 kg (2 lb 11 oz)
Supplied accessory:
Card remote commander: RM-X304
Parts for installation and connections (1 set)
Design and specifications are subject to change
without notice.
MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and Thomson.
The use of optical instruments with this product
- US and Canadian models:
will increase eye hazard.CAUTION
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MEX-BT2500
TABLE OF CONTENTS
1. SERVICING NOTES
............................................... 4
2. GENERAL ................................................................... 7
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 17
3-2. Cover ........................................................................\
....... 17
3-3. CD Mechanism Deck Block (MG-101TA-188//Q) ......... 18
3-4. ANTENNA Board ........................................................... 18
3-5. MAIN Board .................................................................... 19
3-6. SERVO Board .................................................................. 19
3-7. Chassis (T) Sub Assy ....................................................... 20
3-8. Roller Arm Assy .............................................................. 20
3-9. Chassis (OP) Assy ........................................................... 21
3-10. Chucking Arm Sub Assy ................................................. 21
3-11. Sled Motor Assy .............................................................. 22
3-12. Optical Pick-Up Section .................................................. 23
3-13. OP Service Assy (DAX-25A) .......................................... 23
4. TEST MODE .............................................................. 24
5. DIAGRAMS
5-1. Printed Wiring Boards -“ MAIN Section -“ ...................... 28
5-2. Schematic Diagram -“ MAIN Section (1/3) -“ .................. 29
5-3. Schematic Diagram -“ MAIN Section (2/3) -“ .................. 30
5-4. Schematic Diagram -“ MAIN Section (3/3) -“ .................. 31
5-5. Printed Wiring Board -“ KEY Board -“ ............................. 32
5-6. Schematic Diagram -“ KEY Board -“ ............................... 33
6. EXPLODED VIEWS
6-1. Main Section .................................................................... 38
6-2. Front Panel Section ......................................................... 39
6-3. CD Mechanism Deck Section-1 (MG-101TA-188//Q) ... 40
7. ELECTRICAL PARTS LIST ................................ 41
