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Extracted text from sony mdx c 6500x (Ocr-read)
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laser-tap
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
Ã- LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
Notes on Chip Component Replacement
-Never reuse a disconnected chip component.
-Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Power amplifier sectionOutputs Speaker outputs
(sure seal connectors)
Speaker impedance 4 -“ 8 ohms
Maximum power output 50 W × 4 (at 4 ohms)
GeneralOutputs Audio outputs
Power antenna relay
control lead
Power amplifier control
lead
Telephone ATT control
lead
Tone controls Bass ±9 dB at 100 Hz
Treble ±9 dB at 10 kHz
Power requirements 12 V DC car battery
(negative ground)
Dimensions Approx. 178 × 50 × 183 mm
(7
1/8 × 2 × 7 1/4 in.)
(w/h/d)
Mounting dimensions Approx. 182 × 53 × 162 mm
(7
1/4 × 2 1/8 × 6 1/2 in.)
(w/h/d)
Mass Approx. 1.2 kg (2 lb. 10 oz.)
Supplied accessories Parts for installation and
connections (1 set)
Front panel case (1)
Design and specifications are subject to change without
notice.
Flexible Circuit Board Repairing
- Keep the temperature of the soldering iron around 270 ËšC dur-
ing repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering. The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right avove when
checking it for adustment. It is feared that you will lose your sight.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
(KMS-241C/J1NP)
The laser diode in the optical pick-up block may suffer electrostatic
break-down easily. When handling it, perform soldering bridge to
the laser-tap on the flexible board. Also perform m easures against
electrostatic break-down sufficiently before the operation. The flex-
ible board is easily damaged and should be handled with care.
OPTICAL PICK-UP FLEXIBLE BOARD
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT