Sony mdx c 6500 x service manual

Page 1

2 laser-tap SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ!! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. Notes on Chip Component Replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Power amplifier sectionOutputs Speaker outputs (sure seal connectors) Speaker impedance 4 -“ 8 ohms Maximum power output 50 W × 4 (at 4 ohms) GeneralOutputs Audio outputs Power antenna relay control lead Power amplifier control lead Telephone ATT control lead Tone controls Bass ±9 dB at 100 Hz Treble ±9 dB at 10 kHz Power requirements 12 V DC car battery (negative ground) Dimensions Approx. 178 × 50 × 183 mm (7 1/8 × 2 × 7 1/4 in.) (w/h/d) Mounting dimensions Approx. 182 × 53 × 162 mm (7 1/4 × 2 1/8 × 6 1/2 in.) (w/h/d) Mass Approx. 1.2 kg (2 lb. 10 oz.) Supplied accessories Parts for installation and connections (1 set) Front panel case (1) Design and specifications are subject to change without notice. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ËšC dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right avove when checking it for adustment. It is feared that you will lose your sight. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (KMS-241C/J1NP) The laser diode in the optical pick-up block may suffer electrostatic break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform m easures against electrostatic break-down sufficiently before the operation. The flex- ible board is easily damaged and should be handled with care. OPTICAL PICK-UP FLEXIBLE BOARD NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

Page 2

3 TABLE OF CONTENTS 1. GENERAL Location of Controls ................................................................ 4 Getting Started ......................................................................... 4 Setting the Clock ..................................................................... 4 MD Player CD/MD Unit (optional) ........................................ 5 Radio ....................................................................................... 6 Other Functions ....................................................................... 7 TV/Video (optional) ................................................................ 8 Additional Information ............................................................ 8 Connections ........................................................................... 10 2. DISASSEMBLY 2-1. Sub Panel (MD) Assy ........................................................ 12 2-2. MD Mechanism Block ...................................................... 12 2-3. Main Board ....................................................................... 13 2-4. Heat Sink ........................................................................... 13 2-5. Servo Board ....................................................................... 14 2-6. MD Cover Assy ................................................................. 14 2-7. Float Block ........................................................................ 15 2-8. Lo Motor Assy (Loading) (M903) .................................... 15 2-9. Lever Assy (LE) ................................................................ 16 2-10. Holder Assy ....................................................................... 16 2-11. Chucking Arm Assy .......................................................... 17 2-12. Optical Pick-up (KMS-241C/J1RP) ................................. 17 2-13. SL Motor Assy (Sled) (M902) /SP Motor Assy (Spindle) (M901) .................................... 18 3. DIAGRAMS 3-1. IC Pin Descriptions ........................................................... 19 3-2. Block Diagram -“MD Section-“ .......................................... 27 3-3. Block Diagram -“Tuner Section-“ ....................................... 28 3-4. Block Diagram -“Display Section-“ .................................... 29 3-5. Circuit Boards Location .................................................... 29 3-6. Printed Wiring Board -“MD Mechanism Section-“ ............ 31 3-7. Schematic Diagram -“MD Mechanism Section (1/2)-“ ...... 32 3-8. Schematic Diagram -“MD Mechanism Section (2/2)-“ ...... 33 3-9. Schematic Diagram -“Main Section (1/2)-“ ........................ 34 3-10. Schematic Diagram -“Main Section (2/2)-“ ........................ 35 3-11. Printed Wiring Board -“Main Section-“ .............................. 36 3-12. Printed Wiring Board -“Relay Section-“ ............................. 37 3-13. Schematic Diagram -“Relay Section-“ ................................ 38 3-14. Schematic Diagram -“Display Section-“ ............................. 39 3-15. Printed Wiring Board -“Display Section-“ .......................... 40 3-16. IC Block Diagrams ............................................................ 41 4. EXPLODED VIEWS 4-1. Chassis Section ................................................................. 46 4-2. Front Panel Section ........................................................... 47 4-3. MD Mechanism Section (1) .............................................. 48 4-4. MD Mechanism Section (2) .............................................. 49 5. ELECTRICAL PARTS LIST ........................................ 50