Sony mds m 9 service manual

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Ñ 2 Ñ MODEL IDENTIFICATION Ñ BACK PANEL Ñ 4-977-679-3p 4-977-679-2p PARTS No. US,Canadian model Other model TABLE OF CONTENTS 1. SERVICE NOTE........................................................... 4 2. GENERAL.................................................................... 6 3. TEST MODE 3-1. Setting the Test Mode ......................................................... 11 3-2. Exiting the Test Mode ........................................................ 11 3-3. Basic Operations of the Test Mode .................................... 11 3-4. Selecting the Test Mode ..................................................... 11 3-4-1. Operating the Continuous Playback Mode .............. 11 3-4-2. Operating the Continuous Recording Mode ............ 12 3-4-3. Non-Volatile Memory Mode .................................... 12 3-5. Functions of Other buttons ................................................. 12 3-6. Test Mode Displays ............................................................ 13 3-7. Meanings of Other Displays ............................................... 13 3-8. Precautions for Use of Test Mode ...................................... 13 4. ELECTRICAL ADJUSTMENTS 4-1. Precautions for Checking Laser Diode Emission ............... 14 4-2. Precautions for Use of optical pickup (KMS-210A) .......... 14 4-3. Precautions for Adjustments ............................................... 14 4-4. Creating MO Continuously Recorded Disc ........................ 14 4-5. Temperature Compensation Offset Adjustment ................. 15 4-6. Laser Power Adjustment ..................................................... 15 4-7. Traverse Adjustment ........................................................... 16 4-8. Focus Bias Adjustment ....................................................... 17 4-9. Error Rate Check ................................................................ 17 4-9-1. CD Error Rate Check ............................................... 17 4-9-2. MO Error Rate Check .............................................. 17 4-10. Focus Bias Check ............................................................... 17 4-11. Adjusting Points and Connecting Points ............................ 18 5. DIAGRAMS 5-1. Circuit Boards Location ..................................................... 19 5-2. Block Diagrams .................................................................. 20 5-3. Printed Wiring Board Ñ RF Section Ñ ............................. 26 5-4. Schematic Diagram Ñ RF Section Ñ ............................... 29 5-5. Schematic Diagram Ñ Digital Section Ñ ......................... 33 5-6. Printed Wiring Board Ñ Digital Section Ñ ...................... 37 5-7. Printed Wiring Board Ñ Power Section Ñ ....................... 41 5-8. Schematic Diagram Ñ Power Section Ñ .......................... 42 5-9. Schematic Diagram Ñ Panel Section Ñ ............................ 45 5-10. Printed Wiring Board Ñ Panel Section Ñ ......................... 45 5-11. IC Block Diagrams Ñ Digital Section Ñ .......................... 48 5-12. IC Pin Functions ¥ IC101 RF Amplifier (CXA1981AR) ............................... 49 ¥ IC121 Digital signal processor, digital servo processor, EFM/ACIRC encoder/decoder (CXD2535BR) ............... 50 ¥ IC201 System Control (M37610MD-067FP) ................. 53 ¥ IC271 Shock-Proof Memory Controller, ATRAC Encoder/ Decoder (CXD2536R) ....................... 56 ¥ IC301 A/D Converter (CXD8566M) ............................... 58 ¥ IC701 Display control, LED drive .................................. 59 6. EXPLODED VIEWS 6-1. Front Panel Section ............................................................ 60 6-2. Chassis Section ................................................................... 61 6-3. Mechanism Deck Section (MDM-2B) ............................... 62 6-4. Base Unit Section (MBU-2) ............................................... 63 7. ELECTRICAL ADJUSTMENT................................. 64 Parts No.

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Ñ 3 Ñ SAFETY CHECK-OUT After correcting the original service problem, perform the follow- ing safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, ÒmetallizedÓ knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE The AC leakage from any exposed metal part to earth Ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microampers). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturersÕ instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The ÒlimitÓ indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a pas- sive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A) ATTENTION AU COMPOSANT AYANT RAPPORT Ë LA SƒCURITƒ!! LES COMPOSANTS IDENTIFIƒS PAR UNE MARQUE ! SUR LES DIAGRAMMES SCHƒMATIQUES ET LA LISTE DES PIéCES SONT CRITIQUES POUR LA SƒCURITƒ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIéCES SONY DONT LES NUMƒROS SONT DONNƒS DANS CE MANUEL OU DANS LES SUPPLƒMENTS PUBLIƒS PAR SONY. SAFETY-RELATED COMPONENT WARNING !! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement ¥ Never reuse a disconnected chip component. ¥ Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing ¥ Keep the temperature of soldering iron around 270ûC during repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor when soldering or unsoldering. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. This caution label is located inside the unit. Fig. A. Using an AC voltmeter to check AC leakage. To Exposed Metal Parts on Set 0.15 mF1.5k W AC voltmeter (0.75V) Earth Ground