Sony mdcc 2000 service manual

Page 1

2 MDCC-2000 1. GENERAL·································································· 3 2. DISASSEMBLY 2-1. Cabinet (Upper) Section ··············································· 6 2-2. Switch Section ······························································ 7 2-3. LCD Section ································································· 7 2-4. I/O Section ··································································· 8 2-5. Volume Section ···························································· 8 2-6. Main Board ·································································· 9 2-7. Connector Section ························································ 9 2-8. Door ··········································································· 10 2-9. MD Board ·································································· 10 2-10. Base Unit Section ······················································· 11 2-11. BUM-F1 Board ·························································· 11 2-12. REC/PB Head Assy (HR901) Section ······················· 12 2-13. Holder Assy, Cartridge Section ·································· 12 2-14. Holder Assy, Cartridge Installation ···························· 13 2-15. Optical Pick-up (KMS-250A) Section ······················· 13 3. TEST MODE···························································· 14 4. ELECTRICAL ADJUSTMENTS··························· 27 5. DIAGRAMS 5-1. Circuit Boards Location ············································· 29 5-2. Block Diagrams MD Section ···································· 30 I/O Section ································································· 31 FIFO Section ······························································ 32 CPU Section ······························································· 33 LCD Section ······························································· 34 5-3. Printed Wiring Board MD Section ···························· 35 5-4. Schematic Diagram MD Section (1/4) ······················ 36 5-5. Schematic Diagram MD Section (2/4) ······················ 37 5-6. Schematic Diagram MD Section (3/4) ······················ 38 5-7. Schematic Diagram MD Section (4/4) ······················ 39 5-8. Schematic Diagram BUM Section ···························· 40 5-9. Printed Wiring Board BUM Section ························· 41 5-10. Schematic Diagram Main Section (1/12) ·················· 42 5-11. Schematic Diagram Main Section (2/12) ·················· 43 5-12. Schematic Diagram Main Section (3/12) ·················· 44 5-13. Schematic Diagram Main Section (4/12) ·················· 45 5-14. Schematic Diagram Main Section (5/12) ·················· 46 TABLE OF CONTENTS 5-15. Schematic Diagram Main Section (6/12) ·················· 47 5-16. Schematic Diagram Main Section (7/12) ·················· 48 5-17. Schematic Diagram Main Section (8/12) ·················· 49 5-18. Schematic Diagram Main Section (9/12) ·················· 50 5-19. Schematic Diagram Main Section (10/12) ················ 51 5-20. Schematic Diagram Main Section (11/12) ················ 52 5-21. Schematic Diagram Main Section (12/12) ················ 53 5-22. Printed Wiring Board Main Section ·························· 54 Main Section (1/4) ····················································· 55 Main Section (2/4) ····················································· 56 Main Section (3/4) ····················································· 57 Main Section (4/4) ····················································· 58 5-23. Printed Wiring Board Mute Section ·························· 59 5-24. Schematic Diagram AUDIO Section ························· 60 5-25. Printed Wiring Board Audio Section ························· 61 5-26. Schematic Diagram Level Meter Section ·················· 62 5-27. Printed Wiring Board Level Meter Section ··············· 63 5-28. Schematic Diagram LCD Section ····························· 64 5-29. Printed Wiring Board LCD Section ·························· 65 5-30. Schematic Diagram Switch Section ·························· 66 5-31. Printed Wiring Board Switch Section ······················· 67 5-32. Schematic Diagram Foot Switch Section ·················· 68 5-33. Printed Wiring Board Foot Switch Section ··············· 69 5-34. Schematic Diagram Volume/Serial I/O Section ········ 70 5-35. Printed Wiring Board Volume/Serial I/O Section ····· 71 5-36. Schematic Diagram Line Selector Section ················ 72 5-37. Printed Wiring Board Line Selector Section ············· 73 5-38. IC Pin Function Description ······································ 74 5-39. IC Block Diagrams ····················································· 77 6. EXPLODED VIEWS 6-1. Cabinet Section ·························································· 85 6-2. Key Section ································································ 86 6-3. LCD Section ······························································· 87 6-4. Connector Section ······················································ 88 6-5. MD Mechanism Section (CCMD-2000) (Deck-A/Deck-B) ······························ 89 7. ELECTRICAL PARTS LIST·································· 90 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270°C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat.

Page 2

3 MDCC-2000 CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight. Unleaded solder Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.