Sony mce sv 7 service manual

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2 MCE-SV7 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY. The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis- sion, observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the S curve check in CD section adjustment and check that the S curve waveforms is output three times. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing -Keep the temperature of the soldering iron around 270 ËšC dur- ing repairing. -Do not touch the soldering iron on the same conductor of the circuit board. (within 3 times) -Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNITCAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. The following caution label is located inside the unit.

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3 MCE-SV7 TABLE OF CONTENTS 1. SERVICING NOTES ............................................... 4 2. GENERAL ................................................................... 5 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 6 3-2. Cover ............................................................................... 7 3-3. CD Mechanism Deck (CDM63B) .................................. 7 3-4. MAIN Board ................................................................... 8 3-5. Front Panel Section ......................................................... 8 3-6. PANEL Board, SUB PANEL Board ............................... 9 3-7. Lid (CD) .......................................................................... 9 4. TEST MODE .............................................................. 10 5. ELECTRICAL ADJUSTMENTS CD Section ...................................................................... 11 VIDEO Section ............................................................... 11 6. DIAGRAMS 6-1. Block Diagram -“ CD SERVO Section -“....................... 12 6-2. Block Diagram -“ AUDIO/VIDEO Section -“................ 13 6-3. Block Diagram -“ MAIN Section -“................................ 14 6-4. Note For Printed Wiring Boards and Schematic Diagrams ................................................ 15 6-5. Printed Wiring Board -“ BD Section -“........................... 16 6-6. Schematic Diagram -“ BD Section -“.............................. 17 6-7. Printed Wiring Boards -“ CD CHANGER Section -“............................................ 18 6-8. Schematic Diagram -“ CD CHANGER Section -“......... 19 6-9. Printed Wiring Boards -“ AUDIO/VIDEO Section -“..... 20 6-10. Schematic Diagram -“ AUDIO/VIDEO Section (1/3) -“.................................. 21 6-11. Schematic Diagram -“ AUDIO/VIDEO Section (2/3) -“.................................. 22 6-12. Schematic Diagram -“ AUDIO/VIDEO Section (3/3) -“.................................. 23 6-13. Printed Wiring Boards -“ MAIN Section -“.................... 24 6-14. Schematic Diagram -“ MAIN Section -“......................... 25 6-15. Printed Wiring Boards -“ PANEL Section -“.................. 26 6-16. Schematic Diagram -“ PANEL Section -“....................... 27 6-17. IC Pin Function Description ........................................... 32 7. EXPLODED VIEWS 7-1. Cover, Front Panel Section ............................................. 41 7-2. Chassis Section ............................................................... 42 7-3. CD Mechanism Deck Section-1 (CDM63B) .................. 43 7-4. CD Mechanism Deck Section-2 (CDM63B) .................. 44 7-5. Base Unit Section (BU-30BD61A) ................................ 45 8. ELECTRICAL PARTS LIST ............................... 46