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This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
The following caution label is located inside the unit.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
-Never reuse a disconnected chip component.
-Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
-Keep the temperature of soldering iron around 270ËšC
during repairing.
-Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
-Be careful not to apply force on the conductor when soldering
or unsoldering.
MCE-F808K
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repain parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The emission check enables continuous checking of the S curve.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the S curve check in CD section adjustment and check
that the S curve waveform is output three times.
TABLE OF CONTENTS
1. SERVICING NOTE·····················································
3
2. GENERAL··································································· 4
3. DISASSEMBLY·························································· 5
3-1. Top Cabinet ··································································· 6
3-2. VCD Door, Front Panel Section ··································· 6
3-3. CD Mechanism Deck (DECK ASSY) ·························· 7
3-4. MAIN Board, TOTAL Board ········································ 7
3-5. FRONT Board, C/SKD Board ······································ 8
3-6. Disk Tray ······································································ 8
3-7. Loading Belt, CD Pwb Assy (Loading) ························ 9
3-8. Pick-Up Assy ································································ 9
4. TROUBLESHOOTING ················································· 10
4-1. CD Section ·································································· 10
4-2. MPEG Part Troubleshooting ······································· 15
5. DIAGRAMS ······································································ 29
5-1. Circuit Boards Location ·············································· 29
5-2. Block Diagrams
-“ BD Section -“ ···························································· 30
-“ MPEG Section -“ ······················································ 31
-“ MAIN Section -“ ······················································· 32
5-3. Printed Wiring Board -“ MAIN/PANEL Section -“ ······ 33
5-4. Schematic Diagram -“ MAIN/PANEL Section -“ ········ 34
5-5. Printed Wiring Board -“ TOTAL Section -“ ················· 35
5-6. Schematic Diagram -“ TOTAL Section -“ ···················· 36
5-7. IC Block Diagrams ····················································· 37
5-8. IC Pin Functions ························································· 39
6. EXPLODED VIEWS ······················································ 44
6-1. Cabinet and MAIN FRAME Section ·························· 44
6-2. CD Mechanism Section ·············································· 45
7. ELECTRICAL PARTS LIST ······································· 46