Sony mcs 50 service manual

Page 1

2 MC-S50 TABLE OF CONTENTS 1. SERVICING NOTES .................................................. 3 2. GENERAL ...................................................................... 9 3. DISASSEMBLY 3-1. Disassembly Flow ............................................................ 10 3-2. Case Assy, Upper ............................................................. 10 3-3. Power Board ..................................................................... 11 3-4. LOGIC Board, AUDIO Board, FLEXIBLE (JACK) Board, Jack (J301) ...................... 11 3-5. LOGIC Board, Display Panel, Liquid Crystal (LCD901) .................... 12 4. DIAGRAMS 4-1. Block Diagram ................................................................. 13 4-2. Note for Printed Wiring Boards and Schematic Diagrams ........................................................ 14 4-3. Printed Wiring Board -“ LOGIC Board -“ ........................ 14 4-4. Schematic Diagram -“ LOGIC Board -“ .......................... 15 4-5. Printed Wiring Board -“ AUDIO Board -“ ....................... 16 4-6. Schematic Diagram -“ AUDIO Board -“ .......................... 17 4-7. Printed Wiring Board -“ POWER Board -“ ...................... 18 4-8. Schematic Diagram -“ POWER Board -“ ......................... 19 4-9. IC Pin Function Description ............................................ 22 5. EXPLODED VIEWS 5-1. Upper Case Assy .............................................................. 26 5-2. Board Assy ....................................................................... 27 6. ELECTRICAL PARTS LIST ................................ 28Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 ËšC dur- ing repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 ËšC higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ËšC . Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. Sony, VAIO, the VAIO logo, Music Clip, OpenMG and the OpenMG logo are trademarks of Sony Corporation. Microsoft, Windows, Windows NT, Windows Media, Windows Millennium Edition and their logos are trademarks or registered trademarks of Microsoft Corporation in the United States and/or other countries. US and foreign patents licensed from Dolby Laboratories. All other trademarks and registered trademarks are trademarks or registered trademarks of their respective holders.