Sony ifvt 1 service manual
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Extracted text from sony ifvt 1 service manual (Ocr-read)
Page 1
- SEMI-CF. MANUAL
IFV-T1
US Model
AEP Model
UK Model
E Model
IFV-T1 is the transmitter section in IFV-TR1K and lFV-TR1KK.
SPECIFICATIONS
Video input Pin jack (1): 1 Vp-p, 75 ohms, unbalanced, sync negative
Audio input Pin Jack (2: L, R): 410 st,
Input impedance: more than 47 kilohms
Audio output Stereo mini jack
Operating temperature
0°C to 40°C (32°F to 104°F)
Storage temperature -20°C to 60°C (-4°F to 140°F)
Dimensions Approx. 95 x 230 x 100 mm (3 /4 x 9 V x 4 inches) (w/h/d)
(jack and proiected parts not included)
Mass Approx. 130 g (4.6 02)
Design and specxfications are subject to change without notice.
SERVICING NOTES
Notes on chip component replacement
0 Never reuse a disconnected chip component.
0 Notice that the minus side of a tantaIum capacitor may be dam-
aged by heaL
SECTION 1
GENERAL
. Parts Identification
Light emitter
POWER
ON/OFF switch -.§
VOL control DC IN 9V Tack
Visual/Audio
input jack
PHONES jack
TRANSMITTER
S ONY;
SECTION 2
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given,
CASE (B) ASSY
0 case (3) my
\
o Iwoclaws
0 Moclaws
i)
\
I" t
L-4|
three claws 0 three claws
Page 2
lFV-T1
- Semiconductor
Location
Rel. No.
Location
021
022
023
024
025
026
027
028
031
D71
D99
0100
D101
|C1
|031
|C32
|C101
01
02
03
04
05
06
031
032
033
034
071
072
091
092
093
094
095
096
097
098
0101
(1102
.-
Amwwmmmmabm
o
iiaacboo
VVVAUIUIMOINN
moomoaoammi-LcoNfi
mmIIIIIImImHOOUmwOOmOO macro UJIIFHUIIIIIIII
SECTION 3
DIAGRAMS
3-1. PRINTED WIRING BOARDS
1
I
2
l3l4l516
l 7 l
8
[TX BOARD] (COMPONENT SIDE)
El
J2
PHONES
Note on Printed wiring Board:
. o- : pans extracted from the oomponeni side.
. O : Through hole.
, Patiem irom the side which enables seeing.
(The 0 er layers panems are not indicated.)
Caution:
Patten-I face side:
(Conductor Side)
Parts iaoe side:
(Componeni Side)
Parsonihe patiemiaoeside seenirom
the panem face are indicated.
Pamonmeparisiacesideseenfrom
the pans lace are indicated,