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Extracted text from sony icf f 1 service manual (Ocr-read)
Page 1
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Notes on chip component replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
- Keep the temperature of soldering iron around 270˚C
during repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.
SECTION 1
GENERAL This section is extracted
from instruction manual.
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SECTION 2
DISASSEMBLY
Note :Disassemble the unit in the order as shown below.
Cabinet (rear) assy Set Chassis assy Speaker (SP1)
Vol board Main board
Note :Follow the disassembly procedure in the numerical order given.
2-1. CABINET (REAR) ASSY
5 4 Four screws (+BTP 3 × 12)
3 Two screws (+BTP 3 × 12) 1 Push the knob (Battery box).
2 Box, batter
y
Cabinet (rear) assy
9
8
Two screws
(+P 2.6 × 8)
7 Remove
solderings Chassis assy
5 Knob (vol) 1 Knob
(tune)
2 O ring
(DIA 12.5) 6 O ring (vol)
4 E ring
3 Spring,
ring
3 Speaker (10 cm)(SP1) Claw
Two claws
1 Spring, SP detent2
2-2. CHASSIS ASSY 2-3. SPEAKER (SP1)
