Sony icd p 28 service manual

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2 TABLE OF CONTENTS 1. SERVICE NOTE ................................................................ 3 2. GENERAL Index to Parts and Controls ..................................................... 4 3. DISASSEMBLY 3-1. Case (Upper) Assy .............................................................. 5 3-2. F-SW Board, P-SW Board .................................................. 6 3-3. Main Board ........................................................................\ . 6 3-4. PC Board ........................................................................\ ..... 7 4. TEST MODE ....................................................................... 8 5. DIAGRAMS 5-1. IC Pin Description ............................................................. 11 5-2. Block Diagram .................................................................. 13 5-3. Printed Wiring Board -“ Main Section -“ ............................ 15 5-4. Printed Wiring Board -“ F-SW Section -“ ........................... 16 5-5. Printed Wiring Board -“ P-SW, PC Section -“ .................... 17 5-6. Schematic Diagram -“ Main Section (1/2) -“ ...................... 18 5-7. Schematic Diagram -“ Main Section (2/2) -“ ...................... 19 5-8. IC Block Diagrams ............................................................ 20 6. EXPLODED VIEWS 6-1. Case Section ...................................................................... 21 6-2. Main Board Section .......................................................... 22 7. ELECTRICAL PARTS LIST ........................................ 23 Notes on Chip Component Replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. ICD-P28 - UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

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3 ICD-P28 SECTION 1 SERVICE NOTE 1-1. CAUTIONS OF FLASH MEMORY (IC701) EXCHANGE [Precaution when the flash memory (IC701) is replaced] When the flash memory (IC701) is replaced, be sure to perform the BAD BLOCK check* and writing of the model code. If they are not completed, the unit will not operate normally. * BAD BLOCK check is to check the flash ROM memory area (the BAD BLOCK area) where data cannot be guaranteed. The resultant information of this check is stored in the TOC-AREA so that the BAD BLOCK area should not be used. [BAD BLOCK Check Procedure] 1. When the power is turned on after the flash memory (IC701) is replaced, the BAD BLOCK check starts automatically and the OPR (D701) lights in orange. 2. In about 30 seconds after start of the check, the OPR (D701) changes the color to green indicating that the check is completed. R101 R110 51 5030 31 TP719 TP101 TP102 TP718 TP714 TP715 R717 D701 RED (REC) D701 OPR GRN (PLAY) Q701R716FB103 FB102 R133X101 C106 C105 C114 R104 C116 C111 R135 C107 R105 C101FB101 FB104 R102 R103 R128 C112 C110 C102 C104 C125 B E B C C MAIN BOARD (SIDE B)