Sony hcd zx 9

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2 HCD-ZX9 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. CD/MP3 player section System Compact disc and digital audio system Laser Semiconductor laser (λ =780 nm) Emission duration: continuous Laser Output Max. 44.6 µW* * This output is the value measured at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block with 7 mm aperture. Fr equency response 2 Hz -“ 20 kHz ( ±0.5 dB) Wa ve length 780 -“ 790 nm Signal-to-noise-ratio More than 90 dB Dynamic range More than 90 dB OPTICAL CD DIGITAL OUT (Square optical connector jack, rear panel) Wa ve length 660 nm Output level -“18 dBm T ape deck sectionRecording system 4-track 2-channel, stereo Fr equency response 50 -“ 13,000 Hz ( ±3 dB), using Sony TYPE I tapes Wo w and flutter ±0.15% W. Peak (IEC) 0.1% W. RMS (NAB) ± 0.2% W. Peak (DIN) Tuner sectionFM stereo, FM/AM superheterodyne tuner FM tuner section T uning range 87.5 -“ 108.0 MHz Antenna FM lead antenna Antenna terminals 75 ohms unbalanced Intermediate frequency 10.7 MHz AM tuner section T uning range 530 -“ 1,710 kHz (with the tuning interval set at 10 kHz) 531 -“ 1,710 kHz (with the tuning interval set at 9 kHz) Antenna AM loop antenna Antenna terminals External antenna terminal Intermediate frequency 450 kHz GeneralUS models: Po wer requirements 120 V, 60 Hz Mexican models: Po wer requirements 127 V, 60 Hz Po wer consumption 330 watts Dimensions (w/h/d) (Main Unit) Approx. 362 × 437 × 465 mm (14 1/4 × 17 1/4 × 18 1/4 inches) Mass (Main Unit) Approx. 19.0 kg (14 lb 15 oz) Supplied accessories: AM loop antenna (1) FM lead antenna (1) Remote Commander (1) Batteries (2) Speaker cords: -“grey (10m) (33 ft) (2) -“white (3m) (10 ft) (2) Speaker pads (16) Design and specifications are subject to change without notice. Ve r. 1.1

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3 CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. HCD-ZX9 NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. Notes on Chip Component Replacement -N ever reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing -K eep the temperature of soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. This appliance is claassified as a CLASS 1 LASER product. This label is located on the rear exterior. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. 1.5 k -„¦ 0.15 µF ACvoltmeter(0.75 V) To Exposed Metal Parts on Set Earth Ground SAFETY CHECK-OUT (US MODEL) After correcting the original service problem, perform the follow- ing safety check before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE TEST The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a r eturn to chassis, must not exceed 0.5 mA (500 microampers.). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indica- tion is 0.75 V, so analog meters must have an accurate low- v oltage scale. The Simpson 250 and Sanwa SH-63Trd are ex- amples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suit- ab le. (See Fig. A) Fig. A. Using an AC voltmeter to check AC leakage. Ver. 1.1