Sony hcd xb 8 kw service manual

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Ð 2 Ð CAUTIONUse of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Notes on chip component replacement ¥ Never reuse a disconnected chip component. ¥ Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing ¥ Keep the temperature of soldering iron around 270ûC during repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor when soldering or unsoldering. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PROD- UCT MARKING is located on the rear exterior. This caution label is located inside the unit. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repain parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, ob- serve from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the ÒS curve checkÓ in ÒCD section adjustmentÓ and check that the S curve waveform is output three times. SAFETY-RELATED COMPONENT WARNING !! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

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Ð 3 Ð DISASSEMBLY TAPE MECHANISM DECK 6 CASSETTE LID ASSEMBLY 7 CD LID ASSEMBLY 7 CD MECHANISM DECK 8 BASE UNIT 8 DISC TABLE 8 SERVICE MODE9 MECHANICAL ADJUSTMENT11 ELECTRICAL ADJUSTMENT DECK SECTION 11 CD SECTION 14 DIAGRAMS BLOCK DIAGRAMS ¥ CD SECTION 17 ¥ DECK SECTION 19 PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS ¥ CD SECTION 25 to 29 ¥ DECK SECTION 37 to 42 ¥ CD MOTOR SECTION 58 to 60 IC BLOCK DIAGRAMS ¥ CD SECTION 63 ¥ CD MOTOR SECTION 67 DECK SECTION 67 IC PIN FUNCTIONS ¥ CD SECTION 69 to 73 ¥ How to Use this Manual This unit is similar to the HCD-XB8K. For the following details, refer to the service manual (9-960-942- ) for the HCD-XB8K already issued. [Table of Reference Items] SERVICING NOTE ItemHCD-XB8K Reference PageItemHCD-XB8K Reference Page EXPLODED VIEWS TC MECHANISM SECTION 1 (TCM-220WR2) 82 TC MECHANISM SECTION 2 (TCM-220WR2) 83 TC MECHANISM SECTION 3 (TCM-220WR2) 84 CD MECHANISM SECTION (CDM37L-5BD29AL) 85 BASE UNIT SECTION (BU-5BD29AL) 86 ELECTRICAL PARTS LIST AUDIO board 87 BD board 88 CD MOTOR board 90 LEAF SWITCH board 92 LED board 92 TABLE SENSOR board 101