Sony hcd vx 33

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sony hcd vx 33

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3 This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing -Keep the temperature of soldering iron around 270˚C during repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. TABLE OF CONTENTS 1. SERVICE NOTE ·······························································4 2. GENERAL ··········································································5 3. DISASSEMBY ··································································7 4. TEST MODE ····································································12 5. MECHANICAL ADJUSTMENTS ·····························16 6. ELECTRICAL ADJUSTMENTS ·······························16 7. DIAGRAMS 7-1. Circuit Board Location·················································23 7-2. Block Diagrams····························································25 7-3. Printed Wiring Board BD Section·····························28 7-4. Schematic Diagram BD Section································29 7-5. Printed Wiring Board Main Section··························30 7-6. Schematic Diagram Main Section (1/3)····················31 7-7. Schematic Diagram Main Section (2/3)····················32 7-8. Schematic Diagram Main Section (3/3)····················33 7-9. Printed Wiring Board Power AMP Section···············34 7-10. Schematic Diagram Power AMP Section················35 7-11. Printed Wiring Board Panel Section························36 7-12. Schematic Diagram Panel Section···························37 7-13. Printed Wiring Board Leaf SW Section···················38 7-14. Schematic Diagram Leaf SW Section·····················39 7-15. Printed Wiring Board Driver Section·······················40 7-16. Schematic Diagram Driver Section·························41 7-17. Printed Wiring Board Video CD Section·················42 7-18. Schematic Diagram Video CD Section (1/2)···········43 7-19. Schematic Diagram Video CD Section (2/2)···········44 7-20. Printed Wiring Board Power Section·······················45 7-21. Schematic Diagram Power Section··························45 7-22. IC Pin Function Description·······································46 7-23. IC Block Diagrams·····················································50 8. EXPLODED VIEWS 8-1. Main Section·································································54 8-2. Panel Section································································55 8-3. Main Board Section······················································56 8-4. Tape Mechanism Section (TCM-230PWR11) (1/2)·····57 8-5. Tape Mechanism Section (TCM-230PWR11) (2/2)·····58 8-6. CD Mechanism Section (CDM58-K2BD37)···············59 9. ELECTRICAL PARTS LIST ·······································60