Sony hcd v 8900 av

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Ð 2 Ð CAUTIONUse of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. Notes on chip component replacement ¥ Never reuse a disconnected chip component. ¥ Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing ¥ Keep the temperature of soldering iron around 270ûC during repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor when soldering or unsoldering. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PROD- UCT MARKING is located on the rear exterior. SAFETY-RELATED COMPONENT WARNING !! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

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Ð 3 Ð TABLE OF CONTENTS 7-12. Printed Wiring Board Ð Main Section Ð ........................... 47 7-13. Schematic Diagram Ð Main (1/5) Section Ð ..................... 49 7-14. Schematic Diagram Ð Main (2/5) Section Ð ..................... 51 7-15. Schematic Diagram Ð Main (3/5) Section Ð ..................... 53 7-16. Schematic Diagram Ð Main (4/5) Section Ð ..................... 55 7-17. Schematic Diagram Ð Main (5/5) Section Ð ..................... 57 7-18. Printed Wiring Board Ð Deck Section Ð ........................... 59 7-19. Schematic Diagram Ð Deck Section Ð .............................. 61 7-20. Printed Wiring Board Ð Power Section Ð ......................... 63 7-21. Schematic Diagram Ð Power Section Ð ............................ 65 7-22. Schematic Diagram Ð Panel Section Ð ............................. 67 7-23. Printed Wiring Board Ð Panel Section Ð ........................... 69 7-24. Printed Wiring Board Ð TC/CD Panel-1 Section Ð ........... 71 7-25. Schematic Diagram Ð TC/CD Panel-1 Section Ð ............. 73 7-26. Schematic Diagram Ð HP/Mic Section Ð .......................... 75 7-27. Printed Wiring Board Ð HP/Mic Section Ð ....................... 77 7-28. Printed Wiring Board Ð CD Motor Section Ð ................... 79 7-29. Schematic Diagram Ð CD Motor Section Ð ...................... 81 7-30. Printed Wiring Board Ð Trans Section Ð ........................... 83 7-31. Schematic Diagram Ð Trans Section Ð ............................. 85 7-32. Printed Wiring Board Ð Surround Section Ð ..................... 87 7-33. Schematic Diagram Ð Surround Section Ð ....................... 88 7-34. IC Block Diagrams ........................................................... 89 7-35. IC Pin Functions ............................................................... 96 8. EXPLODED VIEWS 8-1. Case and Back Panel Section ............................................ 113 8-2. Front Panel Section-1 ........................................................ 114 8-3. Front Panel Section-2 ........................................................ 115 8-4. Chassis Section ................................................................. 116 8-5. TC Mechanism Section-1 (TCM-220WR2) ..................... 117 8-6. TC Mechanism Section-2 (TCM-220WR2) ..................... 118 8-7. TC Mechanism Section-3 (TCM-220WR2) ..................... 119 8-8. CD Mechanism Section (CDM37L-5BD21L) .................. 120 8-9. Base Unit Section (BU-5BD21AL) .................................. 121 9. ELECTRICAL PARTS LIST ...................................... 122 1. GENERAL .......................................................................... 4 2. DISASSEMBLY 2-1. Front Panel ........................................................................... 5 2-2. Main Board ........................................................................... 6 2-3. Tape Mechanism Deck .......................................................... 6 2-4. Cassette Lid Assembly .......................................................... 7 2-5. CD Lid Assembly .................................................................. 7 2-6. CD Mechanism Deck ............................................................ 8 2-7. Base Unit .............................................................................. 8 2-8. Disc Table ............................................................................. 8 3. SERVICE MODE .............................................................. 9 4. TEST MODE ..................................................................... 11 5. MECHANICAL ADJUSTMENTS.......................... 12 6. ELECTRICAL ADJUSTMENTS ............................... 12 7. DIAGRAMS 7-1. Circuit Boards Location ...................................................... 17 7-2. Block Diagrams ¥ KEY CON Section ........................................................... 18 ¥ CD Section ....................................................................... 19 ¥ Video Section ................................................................... 21 ¥ Deck Section .................................................................... 23 ¥ Main Section .................................................................... 25 ¥ Power Section .................................................................. 27 7-3. Printed Wiring Board Ð CD Section Ð ................................. 31 7-4. Schematic Diagram Ð CD Section Ð ................................... 33 7-5. Printed Wiring Board Ð Video Section Ð ............................. 35 7-6. Schematic Diagram Ð Video (1/4) Section Ð ....................... 37 7-7. Schematic Diagram Ð Video (2/4) Section Ð ....................... 39 7-8. Schematic Diagram Ð Video (3/4) Section Ð ....................... 41 7-9. Schematic Diagram Ð Video (4/4) Section Ð ....................... 43 7-10. Printed Wiring Board Ð Key Control Section Ð ................ 45 7-11. Schematic Diagram Ð Key Control Section Ð ................... 46 MODEL IDENTIFICATION Ñ BACK PANEL Ñ V8900AV: SP, MY V8900AV: CH V8900AV: IA V8900 MODELPARTS No. 4-900-073-0¹ 4-900-073-1¹ 4-900-073-2¹ 4-900-073-3¹ ¥ Abbreviation SP : Singa pore model MY : Malaysia model IA : Indonesian model CH : Chinese model NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, ob- serve from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the ÒS curve checkÓ in ÒCD section adjustmentÓ and check that the S curve waveform is output two times.