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Extracted text from sony hcd rg 110 service manual (Ocr-read)
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HCD-RG110
Tuner sectionFM stereo, FM/AM superheterodyne tuner
FM tuner sectionTuning range 87.5 - 108.0 MHz
Antenna FM lead antenna
Antenna terminals 75 ohms unbalanced
Intermediate frequency 10.7 MHz
AM tuner sectionTuning range 531 - 1,602 kHz (with the
interval set at 9 kHz)
Antenna AM loop antenna
Antenna terminals External antenna terminal
Intermediate frequency 450 kHz
GeneralPower requirements
European models: 230 V AC, 50/60 Hz
Power consumption 105 watts
0.5 watts (at the Power
Saving Mode)
Dimensions (w/h/d) Approx. 280 Γ 325 Γ 412 mm
Mass Approx. 8.5 kg
Supplied accessories: Remote Commander (1)
Batteries (2)
AM loop antenna (1)
FM lead antenna (1)
Front speaker pads (8)
Design and specifications are subject to change without
notice.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
This appliance is classified as a CLASS 1 LASER product. This
label is located on the rear exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
-Never reuse a disconnected chip component.
-Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
-Keep the temperature of soldering iron around 270ΛC
during repairing.
-Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
-Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
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HCD-RG110
TABLE OF CONTENTS
1. GENERAL
........................................................................\
.. 4
2. DISASSEMBLY ................................................................ 6
2-1. Case (Top) ..................................................................... 6
2-2. CD Door ........................................................................\
7
2-3. Front Panel Section ....................................................... 7
2-4. CD Mechanism Deck (CDM58F-K6) .......................... 8
2-5. Tape Mechanism Deck (CWL43FF48) ......................... 8
2-6. REM Board and PANEL Board .................................... 9
2-7. KEY Board ................................................................... 9
2-8. Back Panel Section ..................................................... 10
2-9. SUB TRANS Board, VIDEO OUT Board and SENSOR Board .......................................................... 10
2-10. MAIN Board ............................................................... 11
2-11. POWER Board ............................................................ 11
2-12. TRANS Board ............................................................ 12
2-13. CD Board and DRIVER Board ................................... 12
2-14. SPDL Board ................................................................ 13
2-15. Optical Pick-up (KSM-213DCP)................................ 13
2-16. MOTOR Board, ADDRESS SENSOR Board ............ 14
2-17. Table (New), Cam (Control) and DC Motor ............... 14
3. TEST MODE .................................................................... 15
4. ELECTRICAL ADJUSTMENTS ............................... 17
5. DIAGRAMS ...................................................................... 19
5-1. Circuit Boards Location .............................................. 19
5-2. Block Diagrams .......................................................... 20
5-3. Printed Wiring Boards - CD Section (1/2) - .............. 22
5-4. Printed Wiring Boards - CD Section (2/2) - .............. 23
5-5. Schematic Diagram - CD Section - ........................... 24
5-6. Printed Wiring Board - MAIN Board - ..................... 25
5-7. Schematic Diagram - MAIN Board (1/4) - ............... 26
5-8. Schematic Diagram - MAIN Board (2/4) - ............... 27
5-9. Schematic Diagram - MAIN Board (3/4) - ............... 28
5-10. Schematic Diagram - MAIN Board (4/4) - ................ 29
5-11. Printed Wiring Boards - PANEL Section - ................ 30
5-12. Schematic Diagram - PANEL Section - .................... 31
5-13. Printed Wiring Boards - POWER/TRANS Section - 32
5-14. Schematic Diagram - POWER/TRANS Section - ..... 33
5-15. IC Pin Function Description ....................................... 36
6. EXPLODED VIEWS ...................................................... 38
6-1. Main Section ............................................................... 38
6-2. Front Panel Section ..................................................... 39
6-3. MAIN Board Section .................................................. 40
6-4. CD Mechanism Deck Section (CDM58F-K6) ........... 41
6-5. Optical Pick-up Section (KSM-213DCP) ................... 42
7. ELECTRICAL PARTS LIST ....................................... 43