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HCD-RG100
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tu ner section
Tuning range 87.5 - 108.0 MHz (50-kHz step)
Antenna FM lead antenna
Antenna terminals 75 ohms unbalanced
Intermediate frequ ency 10.7 MHz
AM t uner section
Tuning range 531 - 1,602 kHz (w ith the tuning interval set at
9kHz)
Antenna AM loop antenna
Antenna term inals Ext ernal antenna term inal
Intermediate frequ ency 450 kHz
General
Power requirements 230 V AC, 50/60 Hz
Po wer consumption 55 watts
0.25 watts (at the Power
Saving Mode)
Dimensions (w/h/d) incl. projecting parts and controls
Amplifier/Tuner/Tape/CD section:
Approx. 280 Γ 327 Γ
425 mm
Mass Approx. 8.0 kg
Design and specifications are subject to change
without notice.
The release method of a CD disc tray LOCK function
There is a disc lock function for the disc theft prevention for a
demonstration at a shop front in this machine.
Procedue:
1. Press the ?/1 button to turn the set on.
2. Press two buttons of x and Z (EJECT) simultaneously for
fi ve seconds.
3. The message LOCKED is displayed and the tray is locked. (Even if exiting from this mode, the tray is still locked.)
4. Press two buttons of x and Z (EJECT) simultaneously for
fi ve seconds again.
5. The message UNLOCKED is displayed and the tray is
unlocked.
6. To exit from this mode, press the ?/1 button to turn the set
off.
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
e xterior.
Notes on chip component replacement
-N ever reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
-K eep the temperature of soldering iron around 270ΛC
during repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40 Β°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 Β°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
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HCD-RG100
8. EXPLODED VIEWS
8-1. MAIN Section ....................................................... 52
8-2. Front Panel Section ............................................... 53
8-3. MAIN Board Section ............................................ 54
8-4. CD Mechanism Deck Section-1(CDM74-K6BD80) ............................................... 55
8-5. CD Mechanism Deck Section-2 (CDM74-K6BD80) ............................................... 56
9. ELECTRICAL PARTS LIST ............................... 57
1. SERVICING NOTE.............................................. 4
2. GENERAL............................................................ 6
3. DISASSEMBLY
3-1. Cover (Top) ........................................................... 9
3-2. CD Door ................................................................ 9
3-3. Front Panel Section ............................................... 10
3-4. CD Mechanism Deck (CDM74-K6BD80) ............ 10
3-5. Tape Mechanism Deck, GAME JACK Board ....... 11
3-6. PANEL Board ........................................................ 11
3-7. Back Panel Section, SUB-TRANS Board ............. 12
3-8. Power Transformer ................................................ 12
3-9. MAIN Board ......................................................... 13
3-10. AMP Board ........................................................... 13
3-11. BD80A Board ........................................................ 14
3-12. CONNECT Board ................................................. 14
3-13. DRIVER Board, SW Board .................................. 15
3-14. Optical PICK-UP (KSM-213DCP/Z-NP) ............. 15
3-15. SENSOR Board ..................................................... 16
3-16. MOTOR (TB) Board ............................................. 16
3-17. MOTOR (LD) Board ............................................. 17
4. TEST MODE ......................................................... 18
5. MECHANICAL ADJUSTMENTS ...................... 21
6. ELECTRICAL ADJUSTMENTS...................... 21
7. DIAGRAMS
7-1. Block Diagram - PANEL Section - ...................... 26
7-2. Block Diagrams - MAIN Section - ...................... 27
7-3. Block Diagrams - BD/DRIVER Section - ........... 28
7-4. Printed Wiring Board - BD80A Section - ............ 29
7-5. Schematic Diagram - BD80A Section - ............... 30
7-6. Printed Wiring Board
- CD MECHANISM Section - ............................. 31
7-7. Schematic Diagram - CD MECHANISM Section - ............................. 32
7-8. Printed Wiring Board - MAIN Section - .............. 33
7-9. Schematic Diagram - MAIN Section (1/2) - ........ 34
7-10. Schematic Diagram - MAIN Section (2/2) - ........ 35
7-11. Printed Wiring Board - PANEL COMB Section - ................................... 36
7-12. Schematic Diagram - PANEL COMB Section - ................................... 37
7-13. Printed Wiring Board - PANEL Section - ............ 38
7-14. Schematic - PANEL Section (1/2) - ..................... 39
7-15. Schematic - PANEL Section (2/2) - ..................... 40
7-16. Printed Wiring Board - TRANS Section - ........... 41
7-17. Printed Wiring Board - AMP Section - ................ 42
7-18. Schematic Diagram - AMP POWER Section - .... 43
T ABLE OF CONTENTS