Sony hcd lf 1 service manual

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2 HCD-LF1 Notes on chip component replacement- Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS Q UE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation e xposure. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. DVD player : HCD-LF1 DVD player : HCD-LF1 Sub woofer : SA-WSLF1 Sub woofer : SA-WSLF1 Front speaker :SS-TSLF1(R) SS-TSLF1L(L) Front speaker : SS-TSLF1(R) SS-TSLF1L(L) Center speaker :SS-CTLF1 Center speaker : SS-CTLF1 Surround speaker :SS-TSLF1W(R) SA-TSLF1(L) Surround speaker : SS-TSLF1W(R) SA-TSLF1(L) Remote commander : RM-SP320 Remote commander : RM-SP320 Units required for operationcheck Unit. need to checking aa a aa a aa a aa a aa a a a * 1 * 1 * 2 * 1 Only the defective unit. *2 Either one of them. Units with a mark: The units that are required for the system operation check during\ repair service However, there can be a case that some units of the system need to not b\ e brought into repair shop depending on the unit. that became defective. - The units that are required for the system operation check during r\ epair service

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3 HCD-LF1 TABLE OF CONTENTS 1. SERVICING NOTES ................................................ 4 2. GENERAL ................................................................... 8 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 10 3-2. Stand Section ................................................................... 11 3-3. Cover (MAIN/CDM) ....................................................... 11 3-4. Chassis Section ................................................................ 12 3-5. DLED Board .................................................................... 12 3-6. STBY KEY Board, EJECT KEY Board ......................... 13 3-7. Mechanism Deck (CDM80AT-DVBU29T) ..................... 13 3-8. DMB07 Board ................................................................. 14 3-9. DISPLAY Board .............................................................. 14 3-10. I/O Board ........................................................................\ . 15 3-11. DVD-POW Board ............................................................ 15 3-12. Chassis (Top) ................................................................... 16 3-13. Lever (Loading R/L) ........................................................ 17 3-14. Disc Stop Lever, Disc Sensor Lever ................................ 18 3-15. DRIVER Board ............................................................... 18 3-16. RF Board ........................................................................\ . 19 3-17. Optical Pick-up (DBU-3) ................................................ 19 3-18. Base Unit ........................................................................\ . 20 3-19. Lever (BU Lock) ............................................................. 20 3-20. Close Lever ...................................................................... 21 3-21. DIR Lever, Gear (IDL-B) ................................................ 21 3-22. Gear (IDL-C) ................................................................... 22 4. TEST MODE ............................................................... 23 5. ELECTRICAL ADJUSTMENTS .......................... 32 6. DIAGRAMS 6-1. Block Diagram - RF SERVO Section - ................... 34 - DVD DSP Section - ................................................. 35 - AUDIO Section - ...................................................... 36 - MAIN Section - ....................................................... 37 6-2. Printed Wiring Board - RF Section - ......................... 38 6-3. Schematic Diagram - RF Section - ........................... 39 6-4. Printed Wiring Board - DRIVER Section - ............... 40 6-5. Schematic Diagram - DRIVER Section - ................. 40 6-6. Printed Wiring Board - DMB07 Section (Side A) - .. 41 6-7. Printed Wiring Board - DMB07 Section (Side B) - .. 42 6-8. Schematic Diagram - DMB07 Section (1/10) - ........ 43 6-9. Schematic Diagram - DMB07 Section (2/10) - ........ 44 6-10. Schematic Diagram - DMB07 Section (3/10) - ........ 45 6-11. Schematic Diagram - DMB07 Section (4/10) - ........ 46 6-12. Schematic Diagram - DMB07 Section (5/10) - ........ 47 6-13. Schematic Diagram - DMB07 Section (6/10) - ........ 48 6-14. Schematic Diagram - DMB07 Section (7/10) - ........ 49 6-15. Schematic Diagram - DMB07 Section (8/10) - ........ 50 6-16. Schematic Diagram - DMB07 Section (9/10) - ........ 51 6-17. Schematic Diagram - DMB07 Section (10/10) - ...... 52 6-18. Printed Wiring Board - DVD-POW Section - ........... 53 6-19. Schematic Diagram - DVD-POW Section (1/2) - ..... 54 6-20. Schematic Diagram - DVD-POW Section (2/2) - ..... 55 6-21. Printed Wiring Board - DISPLAY Section - ............. 56 6-22. Schematic Diagram - DISPLAY Section - ................ 57 6-23. Printed Wiring Board - TOUCH KEY Section - ....... 58 6-24. Schematic Diagram - TOUCH KEY Section - ......... 59 6-25. Printed Wiring Board - I/O Section - ........................ 60 6-26. Schematic Diagram - I/O Section - ........................... 61 7. EXPLODED VIEWS 7-1. Stand Section ................................................................... 84 7-2. Main Section .................................................................... 85 7-3. Chassis Section ................................................................ 86 7-4. Mechanism Deck Section-1 (CDM80AT-DVBU29T) .... 87 7-5. Mechanism Deck Section-2 (CDM80AT-DVBU29T) .... 88 7-6. Mechanism Deck Section-3 (CDM80AT-DVBU29T) .... 89 7-7. Base Unit Section ............................................................ 90 8. ELECTRICAL PARTS LIST .................................. 91