Sony hcd gtx 999 service manual

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HCD-GTX999 2 1. SERVICING NOTES ............................................. 3 2. GENERAL .................................................................. 6 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 8 3-2. Case (Top) ....................................................................... 8 3-3. Front Panel Block ........................................................... 9 3-4. USB CONNECTOR Board............................................. 9 3-5. USB MICOM Board ....................................................... 10 3-6. HDD Assy (80 GB) ......................................................... 10 3-7. CD Mechanism Block ..................................................... 11 3-8. Bracket (CDM) Block ..................................................... 11 3-9. Back Panel Block ............................................................ 12 3-10. MAIN Board ................................................................... 12 4. TEST MODE ............................................................ 13 5. ELECTRICAL CHECKS ...................................... 15 6. DIAGRAMS 6-1. Block Diagram - CD SERVO, PANEL Section -............ 16 6-2. Block Diagram - USB, HDD Section - ........................... 17 6-3. Block Diagram - MAIN Section - ................................... 18 6-4. Block Diagram - AMP Section - ..................................... 19 6-5. Block Diagram - POWER SUPPLY Section - ................ 20 6-6. Printed Wiring Board - CD Board - ................................ 22 6-7. Schematic Diagram - CD Board - ................................... 23 6-8. Printed Wiring Board - USB MICOM Board - ............... 24 6-9. Schematic Diagram - USB MICOM Board (1/4) - ......... 25 6-10. Schematic Diagram - USB MICOM Board (2/4) - ......... 26 6-11. Schematic Diagram - USB MICOM Board (3/4) - ......... 27 6-12. Schematic Diagram - USB MICOM Board (4/4) - ......... 28 6-13. Printed Wiring Boards - USB, LED Section - ................ 29 6-14. Schematic Diagram - USB, LED Section - ..................... 29 6-15. Printed Wiring Board - MAIN Board - ........................... 30 6-16. Schematic Diagram - MAIN Board (1/3) - ..................... 31 6-17. Schematic Diagram - MAIN Board (2/3) - ..................... 32 6-18. Schematic Diagram - MAIN Board (3/3) - ..................... 33 6-19. Printed Wiring Boards - INPUT, OUTPUT Section - ..... 34 6-20. Schematic Diagram - INPUT, OUTPUT Section - ......... 34 6-21. Printed Wiring Board - MOTOR Board - ....................... 35 6-22. Schematic Diagram - MOTOR Board - .......................... 35 6-23. Printed Wiring Board - AMP Board - ............................. 36 6-24. Schematic Diagram - AMP Board - ................................ 37 6-25. Printed Wiring Board - KEY Section (1/2) -................... 38 6-26. Schematic Diagram - KEY Section (1/2) - ..................... 39 6-27. Printed Wiring Boards - KEY Section (2/2) - ................. 40 6-28. Schematic Diagram - KEY Section (2/2) - ..................... 41 6-29. Printed Wiring Board - DISPLAY Board - ..................... 42 6-30. Schematic Diagram - DISPLAY Board - ........................ 43 6-31. Printed Wiring Board - TRANS Board - ......................... 44 6-32. Schematic Diagram - TRANS Board - ........................... 45 6-33. Printed Wiring Board - SUB TRANS Board - ................ 46 6-34. Schematic Diagram - SUB TRANS Board - ................... 47 7. EXPLODED VIEWS 7-1. Top Case, Side Panel Section.......................................... 63 7-2. Center Panel Section ....................................................... 64 7-3. Base Panel Section .......................................................... 65 7-4. HDD Section ................................................................... 66 7-5. Chassis Section ............................................................... 67 7-6. CD Mechanism Section (CDM77B-F2BD82F-WAO) .......................................... 68 7-7. Base Unit Section (BU-F2BD82F-A) ............................. 69 8. ELECTRICAL PARTS LIST .............................. 70 Accessories are given in the last of the electrical parts list. TABLE OF CONTENTS NOTES ON CHIP COMPONENT REPLACEMENT - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. FLEXIBLE CIRCUIT BOARD REPAIRING - Keep the temperature of soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY-RELATED COMPONET WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. CAUTION Use of controls or adjustments or performance of procedures other than those speci fi ed herein may result in hazardous radia- tion exposure. This appliance is classifi ed as a CLASS 1 LASER product. This marking is located on the rear exterior. Tuner sectionFM stereo, FM/AM superheterodyne tuner Antenna: FM lead antenna AM loop antenna FM tuner section: Tuning range: Brazilian model: 87.5 -�� 108.0 MHz (100 kHz step) Other models: 87.5 -�� 108.0 MHz (50 kHz step) Intermediate frequency: 10.7 MHz AM tuner section: Tuning range 530-�� 1,710 kHz (with 10 kHz tuning interval) 531 -�� 1,710 kHz (with 9 kHz tuning interval) Intermediate frequency: 450 kHz GeneralPower requirements Latin American models (except for Brazilian model): AC 120, 220, 230 -�� 240 V, 50/60 Hz, adjustable with voltage selector Argentine model: AC 220 V, 50/60 Hz Brazilian model: AC 127 or 220 V, 50/60 Hz, adjustable with voltage selector Power consumption 230 W Dimensions (w/h/d) (excl. speakers) Approx. 280 × 397 × 428 mm Mass (excl. speakers) Approx. 12.3 kg Operating temperature: +5°C (+41 °F) to +35 °C (+95 °F) Operating humidity: 25 % to 80 % change without notice.

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HCD-GTX999 3 SECTION 1 SERVICING NOTES UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscous (sticky, less prone to fl ow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostat- ic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The fl exible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc re fl ective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. RELEASING THE DISC TRAY LOCK The disc tray lock function for the antitheft of an demonstration disc in the store is equipped. Releasing Procedure: 1. Press [ ?/1 ] button to turn the power on. 2. Press the [FUNCTION] button to select CD function. 3. While pressing the [ x] button, press the [ Z] button for more 5 seconds). 4. The message UNLOCKED is displayed and the disc tray is unlocked. Note: When LOCKED is displayed, the slot lock is not released by turning power on/off with the [?/1 ] button. NOTE THE HANDLING OF HDD 1. Note The Transported Do not give set the high impact when you transport this set. HDD might be damaged by the impact. 2. Note The Repairing Do not move the set for state power on, and for at least 30 seconds after the set is power off. HDD might be damaged by the impact. NOTE THE IC5 AND IC13 ON THE USB MICOM BOARD REPLACING IC5 and IC13 on the USB MICOM board cannot exchange with single. When these parts on the USB MICOM board are damaged, exchange the entire mounted board. NOTE THE DISASSEMBLY OF USB CONNECTOR BOARD USB CONNECTOR board and HDD LED (A)/(B) board connec- tion part are damaged easily. Note the printed pattern may peel, remove carefully. NOTE THE IC202 ON THE MAIN BOARD REPLACING Excecute the following procedures immediately after the IC202 on the MAIN board is exchanged, and the cold reset is executed. Procedure: 1. Press the [ ?/1 ] button to turn the power on. 2. Press the [TUNER/BAND] button to select TUNER (FM) function. 3. Press the [TUNING MODE] button on the remote commander to preset menu displayed. 4. Press the [M]/[m] buttons to select FM2 88.00 MHz. 5. Press the [TUNER MEMORY] button on the remote com- mander. 6. Press the [M]/[m] buttons to select FM9. 7. Press the [ENTER] button to preset memory. Note: Do not disconnect the AC plug while this operation. MODEL IDENTIFICATION PA R T N o . -� Rear View -� Model Part No. 120V AC area in E model, Chilean and Peruvian models 3-294-738-0 [] Argentina model 3-294-738-2[] Brazilian model 3-294-738-3[]