Sony hcd gr 8000 service manual

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Ñ 2 Ñ SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.CAUTION Use of control or adjustments or performance of procedures other than those specified hereinmay result in hazardous radiation exposure. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding th elimit for Class 1. The following caution label is located inside the unit. MODEL IDENTIFICATION Ñ BACK PANEL Ñ MODEL PART NO. E 4-993-650-01 SP, MY, TH, AR 4-993-650-21 EA 4-993-650-31 ¥ Abbreviation EA : Saudi Arabia MY : Malaysia SP : Singapore TH : Thailand AR : Argentine 6. DIAGRAMS Circuit Boards Location ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áá 3 6-8. Schematic Diagram Ñ Main (2/2) Section Ñ ááááááááááááááááááá 4 6-9. Schematic Diagram Ñ Main/Trans Section Ñ áááááááááááááááááá 7 6-10. Printed Wiring Board ÑMain/Trans Section Ñ áááááááááááááá 11 6-13. Printed Wiring Board Ñ Power AMP Section Ñ áááááááááááá 15 6-14. Schematic Diagram Ñ Power AMP Section Ñ ááááááááááááááá 17 7. EXPLODED VIEWS (1) Case, MD Assy Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\ á 19 (2) Front Panel Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\ ááááááá 20 (3) Chassis Section ááááááááááááááááááááááááááááááááááááááááááááááááááá\ áááááááááááááá 21 8. ELECTRICAL PARTS LIST ááááááááááááááááááááááááááááááááááá 22 TABLE OF CONTENTS SERVICING NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefor , when checking the laser diode emission, observe from more than 30 cm away from the objective lens. Note on chip component replacement ¥ Never reuse a disconnected chip component. ¥ Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing ¥ Keep the temperature of the soldering iro around 270 ûC during repairing. ¥ Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). ¥ Be careful not to apply force on the conductor whe soldering or unsoldering.

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HCD-GR8000 SECTION 6 DIAGRAMS -Circuit Boarts Location6-8. SCHEMATIC DIAGRAM - MAIN (2/2) SECTION - (Refer to the HCD-D60/GR7/GR7J/RX70 service manual page 51.) Note: -All capacitors are in µF unless otherwise noted. pF: µµF 50WV or less are not indicated except for electrolytics and tantalums. -All resistors are in -„¦ and 1/4W or less unless otherwise specified. - B+ : B+ Line. - B-“ : B-“ Line. - : adjustment for repair. -Voltages are dc with respect to ground under no-signal conditions. no mark : FM TUNER -Voltages are taken with a VOM (Input impedance 10M-„¦). Voltage variations may be noted due to normal production tolerances. -Signal path : PB (DECK A) : PB (DECK B) : PB (DECK B) - 3 - 4 - 5 - 6 - - Refer to page 11 for Printed Wiring Board (MAIN BOARD) PANEL board HP/MIC board TC SW boardCD SW boardDECO boardTRANSFORMER boardTRANSFORMER SW board ENCAPSULATE D COMPONENT MAIN board POWER (R) board POWER (L) board MOTOR (TURN) board MOTOR (SLIDE) board CONNECTOR board BD board AUDIO board LEAF SWITCH board SENSOR board MOTOR board