Sony hcd gnx 80 service manual

Page 2

HCD-GNX80

Tape deck section
Recording system
Frequency response

4»track 2-channel stereo
50 e 13,000 Hz (i3 dB),
using Sony TYPE I tape

Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
Antenna
Antenna terminals
Intermediate frequency
AM tuner section
Tuning range
North and Latin American models:
530 71,710 kHz
(with the interval set at 10 kHz)
531 ~ 1,710 kHz
(with the interval set at 9 kHz)

87.5 A1080 MHz
FM lead antenna
75 ohm unbalanced
10.7 MHz

Other models: 531 7 1,602 kHz
(with the interval set at 9 kHz)
530 ~ 1,710 kHz
(with the interval set at 10 kHz)
Antenna AM loop antenna

Antenna terminals External antenna terminal

Intermediate frequency 450 kHz

General

Power requirements

Australian model: 230 ~ 240 V AC, 50/60 Hz

Other models: 120 V, 220 V or 230 A 240 V AC,
50/60 Hz
Adjustable with voltage selector

Power consumption 350 W

Dimensions (w/h/d) (Approx) 280 x 360 x 398.5 mm
Mass (Approx)
Supplied accessories: Remote Commander (1)
Batteries (2)

AM loop antenna (1)

FM lead antenna ( 1)
Front speaker pads (8)
Surround speaker pads (8)
Subwoofer pads (4)

Design and specifications are subject to change without notice.

Notes on chip component replacement
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be
damaged by heat.

Flexible Circuit Board Repairing
- Keep the temperature of soldering iron around 270°C
during repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.

This appliance is classified as
a CLASS 1 LASER product.
This label is located on the rear
exterior.

CLASS 1 LASER PRODUCT
LUOKAN 1 LASERLAITE

KLASS 1 LASERAPPAFIAT

Unleaded solder

Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.

(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

If LEAD FREE MARK

Unleaded solder has the following characteristics.

- Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!

- Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

SAFETY-RELATED COMPONENT WARNING !!

COMPONENTS IDENTIFIED BY MARK A OR DOTTED LINEWITH
MARK A ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.