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Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on
the rear exterior.
This caution
label is located
inside the unit.
CAUTIONUse of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
¥ Never reuse a disconnected chip component.
¥ Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
¥ Keep the temperature of soldering iron around 270ûC
during repairing.
¥ Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
¥ Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
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Ñ 3 ÑTABLE OF CONTENTS
1. GENERAL
.......................................................................... 4
2. DISASSEMBLY
2-1. CD Door ............................................................................... 5
2-2. Back Panel ............................................................................ 5
2-3. CD Mechanism Deck ............................................................ 6
2-4. Front Panel and Main Board ................................................. 6
2-5. CD Tray ................................................................................ 7
2-6. CD Decoder Board ................................................................ 7
2-7. Base Unit .............................................................................. 8
3. MECHANICAL ADJUSTMENTS ................................ 9
4. ELECTRICAL ADJUSTMENTS ................................. 9
5. DIAGRAMS
5-1. Circuit Boards Location ...................................................... 14
5-2. Block Diagrams
¥ Tuner Section (E, AR, MX models) ................................. 15
¥ Tuner Section (AEP, UK models) .................................... 17
¥ CD Section ....................................................................... 19
¥ Deck Section .................................................................... 21
¥ Main Section (E, AR, MX models) ................................. 23
¥ Main Section (AEP, UK models) ..................................... 25
¥ Power Section (E, AR, MX models) ................................ 27
¥ Power Section (AEP, UK models) ................................... 28
5-3. IC Block Diagrams .............................................................. 29
5-4. Printed Wiring Board ÑMain Section Ñ
(E, AR, MX models) ........................................................... 34
5-5. Schematic Diagram Ñ Main Section Ñ
(E, AR, MX models) ........................................................... 39
5-6. Schematic Diagram Ñ Main Section Ñ
(AEP, UK models) .............................................................. 43
5-7. Printed Wiring Board ÑMain Section Ñ
(AEP, UK models) .............................................................. 47
5-8. Printed Wiring Board Ñ CD Section Ñ ............................. 52
5-9. Schematic Diagram Ñ CD Section Ñ ............................... 57
5-10. Schematic Diagram Ñ Panel Section Ñ ......................... 61
5-11. Printed Wiring Board Ñ Panel Section Ñ ....................... 65
5-12. Printed Wiring Board Ñ Tuner Section Ñ
(E, AR, MX models) ......................................................... 71
5-13. Schematic Diagram Ñ Tuner Section Ñ
(E, AR, MX models) ......................................................... 75
5-14. Schematic Diagram Ñ Tuner Section Ñ
(AEP, UK models) ............................................................ 79
5-15. Printed Wiring Board Ñ Tuner Section Ñ
(AEP, UK models) ............................................................ 83
5-16. IC Pin Function ................................................................ 87
6. EXPLODED VIEWS
6-1. Case and Back Panel ........................................................... 89
6-2. Front Panel Section ............................................................. 90
6-3. Cassette Mechanism Deck Section 1 .................................. 91
6-4. Cassette Mechanism Deck Section 2 .................................. 92
6-5. CD Mechanism Deck Section 1 .......................................... 93
6-6. CD Mechanism Deck Section 2 .......................................... 94
6-7. Base Unit Section (KSM-213BCM) ................................... 95
7. ELECTRICAL PARTS LIST ........................................ 96
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
MODEL IDENTIFICATION
Ñ AC POWER SUPPLY CODE Ñ
AEP model
UK model
Mexican model (Without voltage selector)
E, Argentine model (With voltage selector)
¥ Abbreviation
AR : Argentine model
MX : Mexican model
