Sony hcd ec 909 ver1 0

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HCD-EC709iP/EC909iP 2 NOTES ON CHIP COMPONENT REPLACEMENT - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. FLEXIBLE CIRCUIT BOARD REP AIRING - Keep the temperature of soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY CHECK-OUT After correcting the original service problem, perform the follow-ing safety check before releasing the set to the customer:Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below . LEAKAGE TESTThe AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods.1. A commercial leakage tester , such as the Simpson 229 or RCA WT -540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63T rd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suitable. (See Fig. A) 1.5 k 0.15 F AC voltmeter(0.75 V) T o Exposed Metal Parts on Set Earth Ground Fig. A. Using an AC voltmeter to check AC leakage. SAFETY-RELATED COMPONENT W ARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMA TIC DIAGRAMS AND IN THE P ARTS LIST ARE CRITICAL TO SAFE OPERA TION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE P ART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. A TTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC- TIONNEMENT . NE REMPLACER CES COMPOSANTS QUE P AR DES PIÈCES SONY DONT LES NUMÉROS SONT DON- NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS P AR SONY. CAUTION Use of controls or adjustments or performance of procedures other than those speci ed herein may result in hazardous radia- tion exposure. This appliance is classi ed as a CLASS 1 LASER product.This marking is located on the rear exterior .

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HCD-EC709iP/EC909iP 3 1. SERVICING NOTES ............................................. 4 2. DISASSEMBL Y 2-1. Disassembly Flow ........................................................... 6 2-2. Side Panel (L)/(R) ........................................................... 6 2-3. Ornament Plate (Dock) or iPod Assy .............................. 7 2-4. IP Board Block, Base (Dock) Block ............................... 8 2-5. Top Panel Block .............................................................. 8 2-6. Back Panel Block ............................................................ 9 2-7. MAIN Board ................................................................... 9 2-8. Front Panel Block ........................................................... 10 2-9. Knob (VOL) .................................................................... 10 2-10. Base Unit (BU-D1BD73) ................................................ 11 2-1 1. Optical Pick-up Block (DA1 1MMVGP) ........................ 11 3. TEST MODE ............................................................ 12 4. ELECTRICAL CHECK ......................................... 13 5. DIAGRAMS 5-1. Block Diagram - CD SER VO, TUNER Section - ........... 14 5-2. Block Diagram - MAIN Section - ................................... 15 5-3. Block Diagram - PANEL, POWER SUPPL Y Section - ........................... 16 5-4. Printed Wiring Board - BD73 Board - ............................ 18 T ABLE OF CONTENTS 5-5. Schematic Diagram - BD73 Board - ............................... 19 5-6. Printed Wiring Boards - iPod & iPhone, JACK Section - ................................... 20 5-7. Schematic Diagram - iPod & iPhone, JACK Section - ................................... 21 5-8. Printed Wiring Board - MAIN Board (Component Side) - ................................ 22 5-9. Printed Wiring Board - MAIN Board (Conductor Side) - .................................. 23 5-10. Schematic Diagram - MAIN Board (1/2) - ..................... 24 5-1 1. Schematic Diagram - MAIN Board (2/2) - ..................... 25 5-12. Printed Wiring Board - P ANEL Board - ......................... 26 5-13. Schematic Diagram - P ANEL Board - ............................ 27 5-14. Printed Wiring Board - POWER Board - ........................ 28 5-15. Schematic Diagram - POWER Board - .......................... 29 6. EXPLODED VIEWS 6-1. Overall Section ............................................................... 34 6-2. Top Panel Section ........................................................... 35 6-3. Front Panel Section ......................................................... 36 6-4. iPod Dock Section .......................................................... 37 6-5. MAIN Board Section ...................................................... 38 6-6. Chassis Section ............................................................... 39 7. ELECTRICAL PARTS LIST .............................. 40