Sony hcd ec 78 service manual

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HCD-EC68/EC78 2 1. SERVICING NOTES ............................................. 3 2. GENERAL .................................................................. 6 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 8 3-2. Side Panel (L)/(R) ........................................................... 9 3-3. Top Panel (EC68: UK model)/Top Panel Block (Except EC68: UK model) .............................................. 9 3-4. Tape Mechanism Deck (Except EC68: UK model) ........ 10 3-5. MAIN Board ................................................................... 10 3-6. Front Panel Section ......................................................... 11 3-7. Back Panel Block ............................................................ 11 3-8. CD Mechanism Block ..................................................... 12 3-9. BU Block ........................................................................\ 12 3-10. OP Base Assy (KSM-213D) ........................................... 13 4. TEST MODE ............................................................ 14 5. MECHANICAL ADJUSTMENTS ...................... 18 6. ELECTRICAL ADJUSTMENTS ........................ 18 7. DIAGRAMS 7-1. Printed Wiring Board - CD Board - ................................ 24 7-2. Schematic Diagram - CD Board - ................................... 25 7-3. Printed Wiring Board - DECK Board (Except EC68: UK model) - .................. 26 7-4. Schematic Diagram - DECK Board (Except EC68: UK model) - .................. 26 7-5. Printed Wiring Board - MAIN Board - ........................... 27 7-6. Schematic Diagram - MAIN Board (1/2) - ..................... 28 7-7. Schematic Diagram - MAIN Board (2/2) - ..................... 29 7-8. Printed Wiring Board - HI AMP Board (EC78) - ........... 30 7-9. Schematic Diagram - HI AMP Board (EC78) - .............. 30 7-10. Printed Wiring Board - LOW AMP Board - ................... 31 7-11. Schematic Diagram - LOW AMP Board - ...................... 31 7-12. Printed Wiring Board - PANEL Board (Suf fi x-12) - ...... 32 7-13. Printed Wiring Board - PANEL Board (Suf fi x-13) - ...... 32 7-14. Schematic Diagram - PANEL Board - ............................ 33 7-15. Printed Wiring Boards - KEY Section - .......................... 34 7-16. Schematic Diagram - KEY Section - .............................. 34 7-17. Printed Wiring Board - PT Board - ................................. 35 7-18. Schematic Diagram - PT Board - .................................... 36 8. EXPLODED VIEWS 8-1. Panel Section ................................................................... 44 8-2. Tape Deck Section (Except EC68: UK).......................... 45 8-3. Front Panel Section ......................................................... 46 8-4. Chassis Section ............................................................... 47 8-5. Main Section ................................................................... 48 8-6. CD Mechanism Section (CDM88A-K6BD90-WOD) .... 49 9. ELECTRICAL PARTS LIST .............................. 50 TABLE OF CONTENTS SAFETY-RELATED COMPONET WARNING! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Notes on chip component replacement - Never reuse a disconnected chip component. - Notice that the minus side of a tantalum capacitor may be dam- aged by heat. Flexible Circuit Board Repairing - Keep the temperature of soldering iron around 270 °C during repairing. - Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). - Be careful not to apply force on the conductor when soldering or unsoldering. This appliance is classified as a CLASS 1 LASER product. This marking is located on the rear exterior. CAUTION Use of controls or adjustments or performance of procedures other than those speci fi ed herein may result in hazardous radiation exposure. General Power requirements: European and Russian models: AC 230 V, 50/60 Hz Mexican model: AC 127 V, 60 Hz Argentine model: AC 220 V, 50/60 Hz Australian model: AC 230 -� 240 V, 50/60 Hz Other models: AC 120, 220 or 230 -� 240 V, 50/60 Hz, adjustable with voltage selector Power consumption: HCD-EC78 European and Russian models: 160 W 0.5 W (in Power Saving Mode) Mexican model: 160 W Other models: 150 W HCD-EC68European and Russian models (except for the UK model): 100 W 0.5 W (in Power Saving Mode) Other models: 100 W Dimensions (w/h/d) (excl. speakers):Approx. 200 × 306 × 415 mm Mass (excl. speakers): HCD-EC78 European and Russian models: Approx. 6.0 kg Other models: Approx. 6.3 kg HCD-EC68European and Russian models (except for the UK model): Other models: Approx. 5.3 kg Approx. 5.3 kg

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HCD-EC68/EC78 3 SECTION 1 SERVICING NOTES Model Part No. EC68: AEP model 3-296-777-0[] EC68: 120V AC area in E, Chilean and Peruvian models 3-296-779-0 [] EC78: AEP model 3-296-780-0[] EC78: 120V AC area in E, Chilean and Peruvian models 3-296-782-0 [] EC68: Russian model 3-398-081-0[] EC68: UK model 3-398-082-0[] EC68: 240V AC area in E model 3-398-083-0[] EC68: Australian model 3-398-084-0[] EC68: Mexican model 3-398-085-0[] EC68: Argentina model 3-398-086-0[] EC78: Russian model 3-398-088-0[] EC78: 240V AC area in E model 3-398-090-0[] EC78: Mexican model 3-398-091-0[] EC78: Argentina model 3-398-092-0[] MODEL IDENTIFICATION -� Back Panel -� NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostat- ic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The fl exible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc re fl ective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. - Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! - Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to fl ow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. - Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. RELEASING THE DISC TRAY LOCK The disc tray lock function for the antitheft of an demonstration disc in the store is equipped. Releasing Procedure: 1. Press [I/ 1] button to turn the power on. 2. Press the [FUNCTION] button to select CD function. 3. While pressing the [ x] button, press the [ Z] button for more 5 seconds). 4. The message UNLOCKED is displayed and the disc tray is unlocked. Note: When LOCKED is displayed, the slot lock is not released by turning power on/off with the [I/1] button. MODEL NUMBER LABEL SUFFIX-12/SUFFIX-13 DISCRIMINATION OF PANEL BOARD S301 -� PANEL Board (Component Side) -� LCD301 S301 CN304 Suffix-12 : 1-875-490-12 Suffix-13 : 1-875-490-13