Page 1
HCD-EC59
2
1. SERVICING NOTES ............................................. 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 6
2-2. Side Panel (L)/(R) ........................................................... 7
2-3. Top Panel Assy ................................................................ 7
2-4. Front Panel Block ........................................................... 8
2-5. Knob (VOL) .................................................................... 8
2-6. MAIN Board ................................................................... 9
2-7. Base Unit (BU-D1BD74UR) .......................................... 10
2-8. Optical Pick-up Block (DA11MMVGP) ........................ 10
3. TEST MODE ............................................................ 11
4. ELECTRICAL CHECKS ...................................... 13
5. DIAGRAMS
5-1. Printed Wiring Board - CD Section - .............................. 18
5-2. Schematic Diagram - CD Section - ................................. 19
5-3. Printed Wiring Board - USB Section - ............................ 20
5-4. Schematic Diagram - USB Section - .............................. 21
5-5. Printed Wiring Boards - MAIN Section - ....................... 22
5-6. Schematic Diagram - MAIN Section - ........................... 23
5-7. Printed Wiring Boards
- 2CH AMP/USB-JACK/JACK Boards - ....................... 24
5-8. Schematic Diagram
- 2CH AMP/USB-JACK/JACK Boards - ....................... 25
5-9. Printed Wiring Board - PANEL Board - ......................... 26
5-10. Schematic Diagram - PANEL Board - ............................ 27
5-11. Printed Wiring Board - PT-SWITCH Board - ................. 28
5-12. Schematic Diagram - PT-SWITCH Board - ................... 29
6. EXPLODED VIEWS
6-1. Overall Section ............................................................... 32
6-2. Front Panel Section ......................................................... 33
6-3. Chassis Section ............................................................... 34
6-4. Top Panel Section ........................................................... 35
7. ELECTRICAL PARTS LIST .............................. 36
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS NOTES ON CHIP COMPONENT REPLACEMENT
- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be dam- aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
- Keep the temperature of soldering iron around 270 °C during repairing.
- Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those speci fi ed herein may result in hazardous radia-
tion exposure.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
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HCD-EC59
3
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40 °C higher than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc re fl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens. MODEL IDENTIFICATION
- Back Panel -
Model
Number
Label
Model
Part No.
Argentina model 4-184-199-0[]
Mexican model 4-184-200-0[]
African model 4-184-201-0[]
120V AC area in E model,
Chilean and Peruvian models 4-187-950-0
[]
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning on
the SW305 (push switch type).
The following checking method for the laser diode is operable.
- Method
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. Push the SW305 as shown in Fig. 1.
Note: Do not push the detection lever strongly, or it may be bent or
damaged.
3. Check the object lens for con fi rming normal emission of the
laser diode. If not emitting, there is a trouble in the automatic
power control circuit or the optical pick-up.
In this operation, the object lens will move up and down 2 times along with inward motion for the focus search.
SW305
Fig. 1. Method to push the SW305
