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HCD-EC50
TABLE OF CONTENTS
1. SERVICING NOTES
................................................ 3
2. GENERAL ................................................................... 4
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 6
3-2. Side Panel (L) And Side Panel (R) .................................. 7
3-3. Top Section ...................................................................... 7
3-4. Front Panel Section ......................................................... 8
3-5. PANEL Board .................................................................. 8
3-6. JACK Board ..................................................................... 9
3-7. MAIN Board .................................................................... 9
3-8. CD Section And Base Unit (BU-K6BD83S-WOD) Section ....................................... 10
3-9. Chassis (main mold) ........................................................ 11
3-10. PT Board And Power Transformer .................................. 11
4. MECHANICAL ADJUSTMENTS ......................... 12
5. ELECTRICAL ADJUSTMENTS .......................... 12
6. DIAGRAMS
6-1. Block Diagram - BD/DRIVER Section - .................. 18
6-2. Block Diagram - TUNER Section - .......................... 19
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
Ã- LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
Q UE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
6-3. Block Diagram - MAIN Section - ............................. 20
6-4. Printed Wiring Board - BD Section - ........................ 21
6-5. Schematic Diagram - BD Section - ........................... 22
6-6. Printed Wiring Board - MAIN Section - ................... 23
6-7. Schematic Diagram - MAIN Section (1/3) - ............. 24
6-8. Schematic Diagram - MAIN Section (2/3) - ............. 25
6-9. Schematic Diagram - MAIN Section (3/3) - ............. 26
6-10. Printed Wiring Board - PANEL Section - ................. 27
6-11. Schematic Diagram - PANEL Section - .................... 28
6-12. Printed Wiring Board - AMP Section - ..................... 29
6-13. Schematic Diagram - AMP Section - ........................ 30
6-14. Printed Wiring Board - POWER Section - ................ 31
6-15. Schematic Diagram - POWER Section - .................. 31
7. EXPLODED VIEWS
7-1. Overall Section ................................................................ 38
7-2. Front Panel Section ......................................................... 39
7-3. Chassis Section ................................................................ 40
7-4. Top Section ...................................................................... 41
7-5. CD Section And Base Unit (BU-K6BD83S-WOD) Section ....................................... 42
8. ELECTRICAL PARTS LIST .................................. 43
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HCD-EC50
Notes on chip component replacement- Never reuse a disconnected chip component.
- Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing - Keep the temperature of the soldering iron around 270 °C
during repairing.
- Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
- Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, metallized knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
1.5 k -„¦ 0.15 µF AC voltmete r (0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
e xposure.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
- Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
- Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
- Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the S curve check in CD section adjustment and check
that the S curve waveforms is output three times.
SECTION 1
SERVICING NOTES
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
e xceeding the limit for Class 1.
When carrying this system
1 Remove all discs to protect the CD mechanism.
2 Hold down CD u (play/pause) on the unit, and press
?/1 until STANDBY appears.
3 After LOCK appears, unplug the power cord.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
CAUTION
