Sony hcd dp 700v 1 3

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2 SAFETY CHECK-OUT (US model only) After correcting the original service problem, perform the following safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microampers). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A) Earth GroundAC voltmeter (0.75V) 1.5k-„¦ 0.15µF Fig. A. Using an AC voltmeter to check AC leakage. To Exposed Metal Parts on Set Outputs MD/VIDEO OUT: voltage 250 mV, (phono jacks) impedance 1 kilohms PHONES: accepts headphones of (stereo mini jack) 8 ohms or more SPEAKER (Central and South American models): accepts impedance of 6 to 16 ohms (Other models): accepts impedance of 8 to 16 ohms SUB WOOFER: voltage 1 V, impedance 1 kilohms CD player section System Compact disc and digital audio system Laser Semiconductor laser (λ=780 nm) Frequency response 2 Hz -“ 20 kHz (±0.5 dB) Signal-to-noise ratio More than 90 dB Dynamic range More than 90 dB DIGITAL OUT OPTICAL (Square optical connector jack, rear panel) Tape player section Recording system 4-track 2-channel stereo Frequency response 40 -“ 13,000 Hz (±3 dB), using Sony TYPE I (DOLBY NR OFF) cassette 40 -“ 14,000 Hz (±3 dB), using Sony TYPE II cassette Wow and flutter ±0.15% W.Peak (IEC) 0.1% W.RMS (NAB) ±0.2% W.Peak (DIN) Tuner section FM stereo, FM/AM superheterodyne tuner FM tuner section Tuning range 87.5 -“ 108.0 MHz Antenna FM lead antenna Antenna terminals 75 ohm unbalanced Intermediate frequency 10.7 MHz AM tuner section Tuning range North American model: 530 -“ 1,710 kHz (with the interval set at 10 kHz) 531 -“ 1,710 kHz (with the interval set at 9 kHz) European and Middle Eastern models: 531 -“ 1,602 kHz (with the interval set at 9 kHz) Other models: 531 -“ 1,602 kHz (with the interval set at 9 kHz) 530 -“ 1,710 kHz (with the interval set at 10 kHz) Antenna AM loop antenna Antenna terminals External antenna terminal Intermediate frequency 450 kHz General Power requirements North American model: 120 V AC, 60 Hz European model: 230 V AC, 50/60 Hz Mexican model: 120 V AC, 60 Hz Other models: 120 V, 220 V or 230 - 240 V AC, 50/60 Hz Adjustable with voltage selector Power consumption US model: 170 watts Canadian model: 170 wattsEuropean model: 180 watts 0.5 watts (during Power Saving Mode) Other models: 150 watts Dimensions (w/h/d) Approx. 280 x 360 x 365 mm Mass North American and European models: Approx. 10.5 kg Other models: Approx. 12.0 kg Design and specifications are subject to change without notice. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.ATTENTION AU COMPOSANT AYANT RAPPORT Ã- LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

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3 This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement -Never reuse a disconnected chip component. -Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing -Keep the temperature of soldering iron around 270˚C during repairing. -Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). -Be careful not to apply force on the conductor when soldering or unsoldering. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. TABLE OF CONTENTS MODEL IDENTIFICATION - BACK PANEL - MODEL US model CND model AEP model MX model E51 model PARTS No. 4-231-829-0s 4-231-829-1s 4-231-829-2s 4-231-829-5s 4-231-829-6s -Abbreviation CND : Canadian model MX : Mexican model E51 : Chiri and Peru model PARTS No. 1. GENERAL ··········································································4 2. DISASSEMBY ··································································6 3. TEST MODE ····································································13 4. MECHANICAL ADJUSTMENTS ·····························17 5. ELECTRICAL ADJUSTMENTS ·······························17 6. DIAGRAMS 6-1. Circuit Board Location·················································23 6-2. Block Diagrams····························································24 6-3. Printed Wiring Board BD Section····························26 6-4. Schematic Diagram BD Section·······························27 6-5. Printed Wiring Board Main Section·························28 6-6. Schematic Diagram Main Section (1/3)···················296-7. Schematic Diagram Main Section (2/3)···················30 6-8. Schematic Diagram Main Section (3/3)···················31 6-9. Printed Wiring Board DSP Section··························32 6-10. Schematic Diagram DSP Section (1/2)···················33 6-11. Schematic Diagram DSP Section (2/2)···················34 6-12. Printed Wiring Board OPT Section························35 6-13. Schematic Diagram OPT Section···························35 6-14. Printed Wiring Board Front Amp Section (AEP/US/ CND model)·································································36 6-15. Schematic Diagram Front Amp Section (AEP/US/ CND model)·································································37 6-16. Printed Wiring Board Front Amp Section (E51/MX model)···········································································38 6-17. Schematic Diagram Front Amp Section (E51/MX model)···········································································39 6-18. Schematic Diagram Surround Amp Section···········40 6-19. Printed Wiring Board Surround Amp Section········40 6-20. Printed Wiring Board Panel Section·······················41 6-21. Schematic Diagram Panel Section (1/2)·················42 6-22. Schematic Diagram Panel Section (2/2)·················43 6-23. Printed Wiring Board Leaf SW Section··················44 6-24. Schematic Diagram Leaf SW Section····················45 6-25. Printed Wiring Board Driver Section······················46 6-26. Schematic Diagram Driver Section························47 6-27. Printed Wiring Board Trans Section·······················48 6-28. Schematic Diagram Trans Section··························49 6-29. IC Pin Function Description·······································50 6-30. IC Block Diagrams·····················································56 7. EXPLODED VIEWS 7-1. Main Section·································································60 7-2. Front Panel Section·······················································61 7-3. Chassis Section·····························································62 7-4. Tape Mechanism Deck Section-1 (TCM-230MWR41) 63 7-5. Tape Mechanism Deck Section-2 (TCM-230AWR41) 64 7-6. CD Mechanism Deck Section (CDM58E-30BD60)····65 7-7. Base Unit Section (BU-30BD60)·································66 8. ELECTRICAL PARTS LIST ·······································67